Surface Roughness and Wettability of SAC/CNT Lead Free Solder

Norliza Ismail; Roslina Ismail; Nik Khairul Amilin Nik Ubaidillah; Azman Jalar; Norazwani Muhammad Zain

doi:10.4028/www.scientific.net/MSF.857.73

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HomeMaterials Science ForumMaterials Science Forum Vol. 857Surface Roughness and Wettability of SAC/CNT Lead...

Surface Roughness and Wettability of SAC/CNT Lead Free Solder

Abstract:

The effect of substrate surface roughness on the wettability of SAC237 (Sn 99.9%, Ag 0.3%, Cu 0.7%) with difference percentage of CNT on copper substrate was investigated. Solder paste of SAC 237 without CNT, 0.01% and 0.04% of CNT were reflowed at 270°C on different surface roughness of Cu substrate (abrasive number 240, 400, 600, 800). Contact angle of soldered samples measured by Infinite Focus Microscope (IFM). As a result, contact angle value of investigated solders range 7° to 20°. Contact angle obtained decreases with the increasing surface roughness of Cu substrate. This demonstrates that rougher substrate enhance the wettability of the solders. Addition of CNT also effects the wettability of investigated solders. Higher composition of CNT show better wettability.

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Materials Science Forum (Volume 857)

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73-75

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.857.73

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Online since:

May 2016

Authors:

Norliza Ismail, Roslina Ismail, Nik Khairul Amilin Nik Ubaidillah, Azman Jalar*, Norazwani Muhammad Zain

Keywords:

Carbon Nanotube, Contact Angle, Roughness, Sn-Ag-Cu, Wettability

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References

[1] Kumar,G. & Prabhu K.N., Review of non-reactive and reactive wetting of liquids on surfaces, Advances in Colloid and Interface Science. 133 (2007) 61-89.

DOI: 10.1016/j.cis.2007.04.009

Google Scholar

[2] Chen, Y. & Duh, J., The Effcet of Substrate Surface Roughness on the Wettability of Sn-Bi Solders, Journal of Materials Science: Materials in Electronics 11 (2000) 279-283.

Google Scholar

[3] Sebo, P. & Stefanik, P., Effect of In Addition on Sn-Ag solder, its Wetting and Shear Strength of Copper Joints, Kovove Mater. 43 (2005) 202-209.

Google Scholar

[4] Han, Y.D., Tan C.M., Nai, S.M.L., Xu,L.Y., Jing H.Y. & Wei,J., Effect of Ni-Coated Carbon Nanotubes on the Microstructure and Properties of Sn-Ag-Cu Solder, Electronic Components and Technology Conference (2010) 979-984.

DOI: 10.1109/ectc.2010.5490658

Google Scholar

[5] Satyanarayan, P.K.N., Wetting Behaviour of Lead-Free Solders on Copper Substrates. Research & Technology in the Coming Decades (CRT 2013), National Conference on Challenges in 2013 (2013) 1-5.

DOI: 10.1049/cp.2013.2550

Google Scholar