Effects of Wetting Behavior on Gallium Addition in In-Zn Solder Alloy

Abstract:

This paper reported the investigation on gallium, Ga addition into In-4.8Zn lead-free solder to improve its wettability performances. The effect of addition of Ga in In-4.8Zn solder alloy was studied. The results show with the addition of 0.5% Ga into the In-4.8Zn composition, the spreading area of In-4.8Zn-0.5Ga solder on copper increase between 35.71 and 43.75 %. Hence, as the spreading area increases, the contact angle decreased from between 22.09 to 39.71 %. Additionally, the addition of Ga as dopant increased the thickness of IMCs layer.

• Periodical: Materials Science Forum (Volume 857)
• Pages: 22-25
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.857.22
• Online since: May 2016
• Authors: Mohd Noor Ervina Efzan*, Mhd Nasir Nur Faziera
• Keywords: Contact Angle, Dopant, Lead Free Solder, Spreading Area, Wettability

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