Effect of Added Elements on Microstructures and Joint Strength of Lead-Free Sn-Based Solder Joint Dispersed IMC Pillar

Abstract:

To create a high reliability solder joint using IMCs dispersed in the joint, the joints with four types of lead-free solder were investigated. The joint with Sn-3.0Ag-0.7Cu-5.0In (mass%) has high die shear force compared to other joints investigated, and the joint with the Ni-electroplated Cu bonded at 300 ^oC for 30 min showed the maximum die shear force due to formation of a large number of fine IMCs. In the joint with Sn-0.7Cu-0.05Ni (mass%), uniform dispersion of a large number of IMCs was achieved, although the die shear force of the joint is lower than that of the joint with Sn-3.0Ag-0.7Cu-5.0In. In the joint with Sn-5.0Sb (mass%), a solder area was remained in the center of the joint although a large number of columnar IMCs form at the joint interface. The die shear force of the joint with Sn-5.0Sb increased with increasing the bonding time due to formation and growth of IMCs. In the joint with Sn-3.0Ag-0.5Cu (mass%), IMCs formed at the joint interface and did not disperse in the entire joint.

• Periodical: Materials Science Forum (Volume 879)
• Pages: 2216-2221
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.879.2216
• Online since: November 2016
• Authors: Yawara Hayashi, Ikuo Shohji*, Yusuke Nakata, Tomihito Hashimoto
• Keywords: Die Shear Test, IMC, Interfacial Reaction, Lead-Free Solder, Microstructure

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