Grain Boundary Engineering of ECAPed OFHC Copper

Abstract:

Grain boundary character distributions (GBCD) of OFHC copper equal-channel angular pressing (ECAP) deformed and then annealed were analyzed by electron back scatter diffraction (EBSD). The experimental results showed that a combination of ECAP deformation and annealing treatments could significantly increase the fraction of low-Σ coincidence site lattice (CSL) boundaries (Σ≤29) and effectively interrupt the connectivity of random boundaries network in OFHC copper. An increase of low-Σ CSL boundaries from 45.27 to 71.06% was observed in as-received material after one pass ECAP strain followed by annealing at 350 °C for 48 h. The connectivity of random boundaries network was interrupted by high fraction of low-Σ CSL boundaries.

• Periodical: Materials Science Forum (Volume 879)
• Pages: 2192-2197
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.879.2192
• Online since: November 2016
• Authors: Wen Feng, Jun Hui Zhang, Sen Yang*
• Keywords: Equal-Channel Angular Pressing (ECAP), Grain Boundary Character Distribution, Grain Boundary Engineering, OFHC Copper

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