Internal Stress Evaluation on SiC Dices after SLID Process

Abstract:

Thin layers of intermetallic (IMC) were prepared using Solid-Liquid Inter-Diffusion (SLID) process. 3μm of Tin was deposited on SiC dice, then soldered on a copper substrate at different temperature: 250-300-330-370°C and different soldering times: 5sec-300 sec - 15 min - 1h. The composition of the IMC was identified using energy dispersive X-Ray spectroscopy (EDX). Two types of intermetallic layers were identified: Cu₃Sn and Cu₆Sn₅. The samples were tested using die shear test. Then the internal stress was measured by X-Ray Diffraction (XRD). XRD spectrum obtained spotted only pure copper present underneath the intermetallic layer. The results showed that the level of residual stress is related to the amount of voids in the solder.

• Periodical: Materials Science Forum (Volume 941)
• Pages: 2115-2120
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.941.2115
• Online since: December 2018
• Authors: Yousra Bettahi*, Caroline Richard
• Keywords: Cu₃Sn, Cu₆Sn₅, Cu-Sn Inter-Diffusion, Intermetallic, Internal Constraints, X-Ray Diffraction

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