[1]
H. Kato, Morphological stability of a solid–liquid interface growing in a cylindrical mold, J. Cryst. Growth. 455 (2016) 19-28.
DOI: 10.1016/j.jcrysgro.2016.09.020
Google Scholar
[2]
W.A. Tiller, K.A. Jackson, J.W. Rutter, B. Chalmers, The redistribution of solute atoms during the solidification of metals, Acta Metall. 1 (1953) 428-437.
DOI: 10.1016/0001-6160(53)90126-6
Google Scholar
[3]
P. Peng, Influence of thermal stabilization on microstructure at the solid/liquid interface in a directionally solidified Sn-Ni peritectic alloy, J. Alloy. Compd. 693 (2017) 799-807.
DOI: 10.1016/j.jallcom.2016.09.283
Google Scholar
[4]
H. Neumann-Heyme, K. Eckert, C. Beckermann, General evolution equation for the specific interface area of dendrites during alloy solidification. Acta Mater. 140 (2017) 87-96.
DOI: 10.1016/j.actamat.2017.08.021
Google Scholar
[5]
R. Mendoza, J. Alkemper, P. Voorhees, The morphological evolution of dendritic microstructures during coarsening, Metall. Mater. Trans. A. 34 (2003) 481-489.
DOI: 10.1007/s11661-003-0084-2
Google Scholar
[6]
R.H. Mathiesen, L. Arnberg, X-ray radiography observations of columnar dendritic growth and constitutional undercooling in an Al–30wt%Cu alloy, Acta Mater. 53 (2005) 947-956.
DOI: 10.1016/j.actamat.2004.10.050
Google Scholar
[7]
V.H. Etgens, M.C.M. Alves, A. Tadjeddine, In situ surface X-ray diffraction studies of electrochemical interfaces at a high-energy third-generation synchrotron facility, Electrochim. Acta 45 (1999) 591-599.
DOI: 10.1016/s0013-4686(99)00237-6
Google Scholar
[8]
T. Wang, F. Cao, P. Zhou, H. Kang, Z. Chen, Y. Fu, T. Xiao, W. Huang, Q. Yuan, Study on diffusion behavior and microstructural evolution of Al/Cu bimetal interface by synchrotron X-ray radiography, J. Alloys Compd. 616 (2014) 550-555.
DOI: 10.1016/j.jallcom.2014.07.172
Google Scholar
[9]
J. Zhu, T. Wang, F. Cao, W. Huang, H. Fu, Z. Chen, Real time observation of equiaxed growth of Sn–Pb alloy under an applied direct current by synchrotron microradiography, Mater. Lett. 89 (2012) 137-139.
DOI: 10.1016/j.matlet.2012.08.094
Google Scholar
[10]
Q. Dong, J. Zhang, J. Dong, Y. Dai, F. Bian, H. Xie, Y. Lu, B. Sun, Anaxial columnar dendrites in directional solidification of an Al–15 wt.% Cu alloy, Mater. Lett. 65 (2011) 3295-3297.
DOI: 10.1016/j.matlet.2011.07.013
Google Scholar
[11]
J. Zhu, T. Wang, F. Cao, W. Huang, H. Fu, Z. Chen, Real time observation of equiaxed growth of Sn–Pb alloy under an applied direct current by synchrotron microradiography, Mater. Lett. 89 (2012) 137-139.
DOI: 10.1016/j.matlet.2012.08.094
Google Scholar
[12]
T. Chen, L. Huang, X. Huang, Y. Ma, Y. Hao, Effects of mould temperature and grain refiner amount on microstructure and tensile properties of thixoforged AZ63 magnesium alloy, J. Alloy. Compd. 556 (2013) 167-177.
DOI: 10.1016/j.jallcom.2012.12.140
Google Scholar
[13]
S.K. Rathi, A. Sharma, M.D. Sabatino, Effect of mould temperature, grain refinement and modification on hot tearing test in Al–7Si–3Cu alloy, Eng. Fail. Anal, 79 (2017) 592-605.
DOI: 10.1016/j.engfailanal.2017.04.037
Google Scholar