Effect of Nickel-Modified SiC Particles on Compressive Damage of SiCp / 7075 Composites

Abstract:

The wettability between silicon carbide and aluminum is poor, silicon carbide is difficult to fuse or the distribution of silicon carbide is not uniform in the ingot when the SiCp / 7075 composite is prepared by melt casting.The surface modification of SiCp by nickel plating can significantly reduce the wetting angle of SiC/Al and improve the distribution uniformity of silicon carbide in SiCp / 7075. In this thesis, the thermal compression process 6.5% SiCp / 7075 reinforced by nickel-plated modified silicon carbide is simulated by DEFOEM-3D software.The influence of the shape and particle size of nickel-plated modified silicon carbide on its compressive damage has been highlighted, and the deformation characteristics of the SiC/Ni/Al interface layer in the thermal compression process have been discussed. The numerical simulation results show that the 6.5% SiCp / 7075 reinforced by spherical nickel-plated modified silicon carbide particles with a particle size of 15 μm has the smallest compression damage value of 0.0426, at this point the compression temperature is 400°C, the compression ratio is 15, and the compression rate is 0.03s^-1. the hot compression test of 6.5% SiCp / 7075 reinforced by spherical nickel-plated modified silicon carbide particles with a particle size of 15 μm was performed by using the same compression parameters as the numerical simulation. After hot pressing, the sample had a smooth surface with few obvious cracks, which was consistent with the numerical simulation results. Key words: nickel-plating modification; silicon carbide particles; compressive damage; grain size; grain morphology

• Periodical: Materials Science Forum (Volume 944)
• Pages: 705-713
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.944.705
• Online since: January 2019
• Authors: Xiao Hong Wang*, Qiao Gang Hu, Shi Yu Zhong, Teng Dang, Hai Lun Wang, Yuan Hua Lin
• Keywords: Compressive Damage, Grain Morphology, Grain Size, Nickel-Plating Modification, Silicon Carbide Particles

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