Thermo-Mechanical Reliability of 1200V-450A IGBT Module Considering Voids in the Solder Layer

Abstract:

1200V-450A IGBT power modules are fabricated in this paper. We study both the steady state and transient thermal performance of the IGBT assemblies by the finite element method using commercial software ANSYS Workbench to better understand the characteristic. Furthermore, power cycling tests indicate that inelastic strain increase as the numbers of cycles increase. In addition, X-ray photographs and ultrasound scan images were compared before and after the experiment. The thrust force of bonding wires decrease with increasing numbers of cycles, as indicated by tested.

• Periodical: Materials Science Forum (Volume 954)
• Pages: 202-209
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.954.202
• Online since: May 2019
• Authors: Xin Hua Guo*, Guang Deng Yang, Jin Yuan Fu, Ke Huang
• Keywords: ANSYS Workbench, Insulated Gate Bipolar Transistor (IGBT), Reliability, Thermo-Mechanical

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