Correlation between Solidified Microstructure Evolution and Undercooling of Au-12 Wt.%Ge Eutectic Alloy

Article Preview

Abstract:

Highly undercooled solidification experiments were carried out by melt purification combined with cyclic superheating method on Au-12 wt.%Ge eutectic alloy. The solidification structures of Au-12 wt.%Ge eutectic alloy under different undercoolings were also analyzed by using the scanning electron microscope (SEM). The experimental results revealed that the maximum undercooling could reach up to 102 K. The microstructure analysis showed that the coarse bulk eutectic existed in the solidification structure when the undercooling was less than 34 K. When the undercooling was larger than 34 K and less than 56 K, the solidification structure transformed into cellular eutectic. The coarse primary (α-Au) phase precipitated from the undercooled alloy melt when the undercooling was larger than 56 K. The volume fraction of the primary (α-Au) phase gradually increased with the increase of undercooling. In this paper, a method to regulate the solidification structure of Au-12 wt.%Ge eutectic alloy is proposed, which provides a new way to improve the solidification structure and has important guiding significance for the processing and forming process of Au-12 wt.%Ge eutectic alloy.

You might also be interested in these eBooks

Info:

Periodical:

Pages:

53-59

Citation:

Online since:

May 2020

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2020 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

* - Corresponding Author

[1] Changlin Yang, Liu Feng, Gencang Yang, Yaohe Zhou, Structure evolution upon non-equilibrium solidification of bulk undercooled Fe–B system. Journal of Crystal Growth 311 (2009), 404-412.

DOI: 10.1016/j.jcrysgro.2008.11.025

Google Scholar

[2] Wei Wei Wang, Bin Bin Jia, Jing Bo Yu, Microstructure Evolution and Mechanical Properties of 7A09 Aluminum Alloy during Rapid Solidifications. Advanced Materials Research 79-82 (2009), 1791-1794.

DOI: 10.4028/www.scientific.net/amr.79-82.1791

Google Scholar

[3] W. Yang, F. Liu, H. F. Wang, B. P. Lu, G. C. Yang, Non-equilibrium transformation kinetics and primary grain size distribution in the rapid solidification of Fe–B hypereutectic alloy. Journal of Alloys & Compounds 509 (2011), 2903-2908.

DOI: 10.1016/j.jallcom.2010.11.152

Google Scholar

[4] Nico Weyrich, Shan Jin, Liliana I. Duarte, Christian Leinenbach, Joining of Cu, Ni, and Ti Using Au-Ge-Based High-Temperature Solder Alloys. Journal of Materials Engineering & Performance 23 (2014), 1585-1592.

DOI: 10.1007/s11665-014-0864-4

Google Scholar

[5] Yunzhu Ma, Wu Tong, Wensheng Liu, Yufeng Huang, Siwei Tang, Yikai Wang, Interfacial microstructure evolution and shear behavior of Au–12Ge/Ni solder joints during isothermal aging. Journal of Materials Science Materials in Electronics 28 (2016), 1-10.

DOI: 10.1007/s10854-016-5974-3

Google Scholar

[6] Lili Ma, Xinglin Huang, Zha Jie, in International Conference on Electronic Packaging Technology. (2013), pp.946-949.

Google Scholar

[7] C. Leinenbach, F. Valenza, D. Giuranno, H. R. Elsener, S. Jin, R. Novakovic, Wetting and Soldering Behavior of Eutectic Au-Ge Alloy on Cu and Ni Substrates. Journal of Electronic Materials 40 (2011), 1533-1541.

DOI: 10.1007/s11664-011-1639-4

Google Scholar

[8] Z. Chen, Y. Zhang, S. Wang, J. Y. Zhang, Q. Tao, P. Zhang, Microstructure and mechanical properties of undercooled Fe 80 C 5 Si 10 B 5 eutectic alloy. Journal of Alloys & Compounds 747 (2018), 846-853.

DOI: 10.1016/j.jallcom.2018.03.065

Google Scholar

[9] B. H Kear, B. C Giessen, M Cohen, Rapidly solidified amorphous and crystalline alloys : proceedings of the Materials Research Society Annual Meeting, November 1981, Boston Park Plaza Hotel, Boston, Massachusetts, U.S.A. Mrs Bulletin 7 (1982), 5-5.

DOI: 10.1557/s0883769400049605

Google Scholar

[10] H. Okamoto, T. B. Massalski, The Au−Ge (Gold-Germanium) system. Bulletin of Alloy Phase Diagrams 5 (1984), 601-610.

DOI: 10.1007/bf02868323

Google Scholar

[11] D. Turnbull, J. C. Fisher, Rate of Nucleation in Condensed Systems. The Journal of Chemical Physics 17 (1949), 71-73.

Google Scholar

[12] Frans Spaepen, A structural model for the solid-liquid interface in monatomic systems. Acta Metallurgica 23 (1975), 729-743.

DOI: 10.1016/0001-6160(75)90056-5

Google Scholar

[13] J. F. Li, W. Q. Jie, S. Zhao, Y. H. Zhou, Structural Evidence for the Transition from Coupled to Decoupled Growth in the Solidification of Undercooled Ni-Sn Eutectic Melt. Metallurgical & Materials Transactions A 38 (2007), 1806-1816.

DOI: 10.1007/s11661-007-9198-2

Google Scholar

[14] S. Zhao, J. F. Li, L. Liu, Y. H. Zhou, Cellular growth of lamellar eutectics in undercooled Ag–Cu alloy. Materials Characterization 60 (2009), 519-524.

DOI: 10.1016/j.matchar.2008.12.006

Google Scholar

[15] Zhao Su, Jinfu Li, Liu Li, Yaohe Zhou, Eutectic growth from cellular to dendritic form in the undercooled Ag–Cu eutectic alloy melt. Journal of Crystal Growth 311 (2009), 1387-1391.

DOI: 10.1016/j.jcrysgro.2008.12.006

Google Scholar

[16] Su Zhao, Dong Lai Wei, Qing Miao, Structures and Undercooling Technology of Ag-28.1 wt.% Cu Eutectic Alloy. Advanced Materials Research 750-752 (2013), 734-738.

DOI: 10.4028/www.scientific.net/amr.750-752.734

Google Scholar