Measurement of Mechanical Properties for Thin Film Using Visual Image Tracing Method

Sang Joo Lee; Seung Woo Han; Jae Hyun Kim; Hak Joo Lee

doi:10.4028/www.scientific.net/SSP.124-126.1701

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HomeSolid State PhenomenaSolid State Phenomena Vols. 124-126Measurement of Mechanical Properties for Thin Film...

Measurement of Mechanical Properties for Thin Film Using Visual Image Tracing Method

Abstract:

It is quite difficult to accurately measure the mechanical properties of thin films. Currently, there are several methods (or application) available for measuring mechanical properties of thin films. Their properties, however, have been determined by indirect methods such as cantilever beam test and diaphragm bulge test. This paper reports the efforts to develop a direct strain measurement system for micro/nano scale thin film materials. The proposed solution is the Visual Image Tracing (VIT) strain measurement system coupled with a micro tensile testing unit, which consists of a piezoelectric actuator, load cell, microscope and CCD cameras. The advantage of this system is the ability to monitor the real time images of specimen during the test in order to determine its Young’s modulus and Poisson’s ratio at the same time. Stress-strain curve, Young’s modulus, yield strength and Poisson’s ratio of copper thin film measured using VIT system are presented.

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Periodical:

Solid State Phenomena (Volumes 124-126)

Pages:

1701-1704

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.124-126.1701

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Online since:

June 2007

Authors:

Sang Joo Lee, Seung Woo Han, Jae Hyun Kim, Hak Joo Lee

Keywords:

Poisson's Ratio, Real-Time, Tensile Test, Thin Film, Young's Modulus

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References

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