Solid State Phenomena
Vol. 134
Vol. 134
Solid State Phenomena
Vols. 131-133
Vols. 131-133
Solid State Phenomena
Vol. 130
Vol. 130
Solid State Phenomena
Vol. 129
Vol. 129
Solid State Phenomena
Vol. 128
Vol. 128
Solid State Phenomena
Vol. 127
Vol. 127
Solid State Phenomena
Vols. 124-126
Vols. 124-126
Solid State Phenomena
Vols. 121-123
Vols. 121-123
Solid State Phenomena
Vol. 120
Vol. 120
Solid State Phenomena
Vol. 119
Vol. 119
Solid State Phenomena
Vol. 118
Vol. 118
Solid State Phenomena
Vols. 116-117
Vols. 116-117
Solid State Phenomena
Vol. 115
Vol. 115
Solid State Phenomena Vols. 124-126
Paper Title Page
Abstract: The electrospinning is a novel and efficient tool for fabrication of carbon nanotube (CNTs)
-polymer composites. We have fabricated polymer/CNTs composite by doping multi-walled carbon
nanotubes (MWNTs) in nylon fibers using electrospinning technique. The solution, containing
MWNTs/nylon, was ejected from the spinneret to form fibers. Spun fibers were collected on the water
surface in the water bath and transfer to the winding drum. We observed that, the unwoven fibers were
transformed into aligned bundles. The fiber alignment is discussed. The electrical properties of the
aligned fibers were analyzed.
1125
Abstract: The organic-inorganic hybrid nanocomposites were successfully obtained by the sol-gel
process with tetraethylorthosilicate (TEOS) as an inorganic networking precursor and
2-hydroxyethylmethacrylate (HEMA) as the nonsurfactant template in the presence of benzil initiator.
The characteristics of the obtained hybrid were examined by means of TGA, FTIR, SEM, and TEM.
The synthesized HEMA/SiO2 hybrid was nearly transparent, monolithic, and monodispersed with the
average size of 25 nm. It was found that the hybrid structure could be defined by intertwining organic
and inorganic polymeric networks.
1129
Abstract: Poly(ε-caprolactone)/multiwalled carbon nanotube (PCL/MWCNT) composites with
different MWCNT contents were successfully prepared by in situ bulk polymerization, which could
make them good competitors for commodity materials such as general purpose plastics, while
allowing them to completely retain their biodegradability. The mechanical properties of the
PCL/MWCNT composites were effectively increased due to the incorporation of the MWCNTs. The
composites were characterized using scanning electron microscopy, in order to obtain information on
the dispersion of the MWCNTs in the polymeric matrix. In the case where 0.5 wt% of MWCNTs were
dispersed in the matrix, the strength and modulus of the composite increased by 23% and 71%,
respectively. In addition, the dispersion of the MWCNTs in the PCL matrix resulted in a substantial
decrease in the electrical resistivity of the composites being observed as the MWCNTs loading was
increased from 0 wt% to 0.5 wt%.
1133
Abstract: Compressive behavior of 7xxx series Al metal matrix composite (MMC) powders with
different ceramic contents and different particle size were investigated. As a starting powder of the
experiments, ceramic contents of each starting powder were 5 and 10 wt.% and ceramic particle
size of starting powder were 20 and 100 ㎛, respectively. And 7xxx Al blended powder was used
for comparison. The powders were uniaxially cold-compacted using cylindrical die with a
compacting pressure 250 MPa and sintered at 620oC in a dry N2 atmosphere for 60 min with heating
rate of 20oC/min. In case of heat treatment condition, sintered parts were solution treated at 475oC
and aged at 175oC. To reveal the effect of Al2O3 particle content and particle size on the mechanical
properties of composites, compression test were conducted with constant strain rate of 1×10-3/s
using sub-size cylindrical samples of 9 mm diameter. Compression test was performed 5 times and
its average value was used. Then fractography analysis was conducted using scanning electron
microscope.
1137
Abstract: The effect of a microwave-enhanced wet chemical etching process of SiC particles on the
electroless copper plating and on the Al/Cu-coated SiC composites was investigated. The
microwave-enhanced wet etching process increased the concentration of surface oxides on SiC. The
BET surface area of SiC increased, reached its maximum value at 30 s, and then decreased during an
etching process. The enhanced chemical adhesion strength between the coated copper and SiC was
observed after an etching process. Furthermore, the sintering density and transverse rupture strength
(TRS) of Al/Cu-coated SiC composites were improved when SiC particles were etched. This result
indicated that the microwave-enhanced etching of SiC particles also improved chemical and
mechanical adhesion of Al/Cu-coated SiC composites.
1145
Abstract: Dense nanostructured ZrSi2-SiC composite was synthesized by high frequency induction
heated combustion synthesis (HFIHCS) method within 1 minute in one step from powders of ZrC
and 3Si. Simultaneous combustion synthesis and densification were accomplished under the
combined effects of an induced current and mechanical pressure. Highly dense ZrSi2-SiC with
relative density of up to 98% were produced under simultaneous application of a 60MPa pressure
and the induced current. The average grain size and mechanical properties (hardness and fracture
toughness) of the composite were investigated.
1149
Abstract: Two methods, High-Frequency Induction-Heated Sintering (HFIHS) and Pulsed Current
Activated Sintering (PCAS), were utilized to consolidate WC-8wt.%Ni hard materials. The
demonstrated advantages of these processes are rapid densification to near theoretical density in a
relatively short time and with insignificant change in grain size. The hardness, fracture toughness, and
the relative density of the dense WC–8Ni composites produced by HFIHS and PCAS were
investigated. And the effect of variation in particle size of WC powder on the sintering behavior and
mechanical properties were investigated.
1153
Abstract: The unprecedented technology advancements in miniaturizing integrated circuits, and the
resulting plethora of sophisticated, low cost electronic devices demonstrate the impact that
micro/nano scale engineering can have when applied only to the area of electrical and computer
engineering. Current research efforts in micro/nano fabrication technology for implementing
integrated devices hope to yield similar revolutions in life science fields. The integrated life chip
technology requires the integration of multiple materials, phenomena, technologies, and functions
at micro/nano scales. By cross linking the individual engineering fields through micro/nano
technology, various miniaturized life chips will have future impacts in the application markets such
as medicine and healthcare.
1157