Solder Joint Reliability in Automotive Applications: New Assessment Criteria through the Use of EBSD

Abstract:

The transition to lead-free materials within the electronics industry has raised the question of solder joint reliability for automotive applications. Traditional analysis methods like shear testing and light microscopic cross section analysis do not offer explanations for different damage appearances of solder joints that seem to have same material properties, same production and aging history. A better understanding of microstructural properties and changes will help to solve those questions. Therefore, EBSD is used to analyze the grain structure of solder joints in the as-soldered state and after different aging conditions. In this paper a test program that is just being carried out at the Volkswagen Lab is summarized and first results of texture analysis are presented.

• Periodical: Solid State Phenomena (Volume 160)
• Pages: 307-312
• DOI: https://doi.org/10.4028/www.scientific.net/SSP.160.307
• Online since: February 2010
• Authors: Antje Steller, Uwe Pape, L. Blair
• Keywords: Electron Backscatter Diffraction (EBSD), Lead-Free, Solder

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