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HomeSolid State PhenomenaSolid State Phenomena Vols. 19-20SOI by Silicon Wafer Direct Bonding - Problems of...

SOI by Silicon Wafer Direct Bonding - Problems of Wafer Warpage and Surface Chemistry

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Gettering and Defect Engineering in Semiconductor Technology IV

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Periodical:

Solid State Phenomena (Volumes 19-20)

Pages:

625-630

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.19-20.625

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Online since:

January 1991

Authors:

G. Kissinger, W. Kissinger, H. Hofmann, Joachim Krüger

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© 1991 Trans Tech Publications Ltd. All Rights Reserved

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