SOI by Silicon Wafer Direct Bonding - Problems of Wafer Warpage and Surface Chemistry

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Periodical:

Solid State Phenomena (Volumes 19-20)

Edited by:

M. Kittler and H. Richter

Pages:

625-630

DOI:

10.4028/www.scientific.net/SSP.19-20.625

Citation:

G. Kissinger et al., "SOI by Silicon Wafer Direct Bonding - Problems of Wafer Warpage and Surface Chemistry", Solid State Phenomena, Vols. 19-20, pp. 625-630, 1991

Online since:

January 1991

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Price:

$35.00

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