Development of Integrated Wet Cleans for 3D-SIC Technologies

Samuel Suhard; Ihsan Simms; Ian H. Brown; Mizota Shogo; Kagawa Koji; Martine Claes; Thibault Buisson; Anne Jourdain; Gerald Beyer; Stefan De Gendt

doi:10.4028/www.scientific.net/SSP.195.150

Paper Titles

One-Step Wet Clean Removal of Post-Etch Fluoropolymer Residues
p.136

Determination of Fluoride Concentration on Aluminum Bond Pads Using Liquid Phase Extraction Ion Chromatography
p.139

Selective High-Throughput TiN Etching Methods
p.143

The Effect of Ar/H2 Plasma Pretreatments on Porous K=2.0 Dielectrics for Pore Sealing by Self-Assembled Monolayers Deposition
p.146

Development of Integrated Wet Cleans for 3D-SIC Technologies
p.150

Post Chemical Mechanical Polish Cleaning Chemistry for through Silicon via Process
p.154

Acoustic Bubbles: Control and Interaction with Particles Adhered to a Solid Substrate
p.161

Single Bubble Cleaning and Vortex Flow
p.165

Acoustic Cavitation Behavior in Isopropyl Alcohol Added Cleaning Solution
p.169

HomeSolid State PhenomenaSolid State Phenomena Vol. 195Development of Integrated Wet Cleans for 3D-SIC...

Development of Integrated Wet Cleans for 3D-SIC Technologies

Abstract:

3D stacked IC (3D-SIC) is one of the main approaches within 3D technologies as it is the most mature and economically viable technology and provides the highest through silicon via density. Enabling 3D SIC requires the modification of standard IC process flows by adding several process modules, such as through silicon via (TSV), wafer bonding and thinning, prior backside processing (e.g. Cu nails exposure), micro bumps formation for the front side and/or the backside and finally stacking to another chips [. Within the 3D-SIC technology developed at IMEC, surface control and preparation by means of wet clean and wet etch are essential steps notably in two key process modules: wafer thinning and micro bump formation.

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Periodical:

Solid State Phenomena (Volume 195)

Pages:

150-153

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.195.150

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Online since:

December 2012

Authors:

Samuel Suhard, Ihsan Simms, Ian H. Brown, Mizota Shogo, Kagawa Koji, Martine Claes, Thibault Buisson, Anne Jourdain, Gerald Beyer, Stefan De Gendt

Keywords:

Bumping, Integrated Clean, Micro-Bumps, Thinning

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References

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