Characterization of Surface Metal Contaminations on Fused Quartz

Shi Liu; Bin Liu

doi:10.4028/www.scientific.net/SSP.195.277

Paper Titles

Diffusion Behavior of Transition Metals Penetrating Silicon Substrate through Silicon Dioxides by Dopant Ion Implantation
p.261

Evaluation of Hafnium Contamination on Wafer Surfaces after the Wet Cleaning Process
p.265

Real-Time Analyses of Metal Contaminations in the ppb-Range
p.269

X-Ray Induced Depth Profiling of Ion Implantations into Various Semiconductor Materials
p.274

Characterization of Surface Metal Contaminations on Fused Quartz
p.277

Cleaning in Crystalline Si Solar Cell Manufacturing
p.283

How to Overcome the Effects of Silicon Build-Up during Solar Cell Wet Chemical Processing
p.289

'Just Clean Enough': Wet Cleaning for Solar Cell Manufacturing Applications
p.293

Optimized Wet Processes and PECVD for High-Efficiency Solar Cells
p.297

HomeSolid State PhenomenaSolid State Phenomena Vol. 195Characterization of Surface Metal Contaminations...

Characterization of Surface Metal Contaminations on Fused Quartz

Abstract:

Micro-contamination exerts ever-increasing adverse impact on semiconductor manufacturing as device integration scale keeps increasing and device geometry continues decreasing. In particular, contaminations from particles, trace metals, and/or organic compounds can reduce device yield, quality, and reliability ^[. Metallic impurities from materials used for process equipment are one of the major contamination sources.