Paper Title:
Characterization of Surface Metal Contaminations on Fused Quartz
  Abstract

Micro-contamination exerts ever-increasing adverse impact on semiconductor manufacturing as device integration scale keeps increasing and device geometry continues decreasing. In particular, contaminations from particles, trace metals, and/or organic compounds can reduce device yield, quality, and reliability [. Metallic impurities from materials used for process equipment are one of the major contamination sources.

  Info
Periodical
Solid State Phenomena (Volume 195)
Chapter
Chapter 7: Metal Contamination
Edited by
Paul Mertens, Marc Meuris and Marc Heyns
Pages
277-279
DOI
10.4028/www.scientific.net/SSP.195.277
Citation
S. Liu, B. Liu, "Characterization of Surface Metal Contaminations on Fused Quartz", Solid State Phenomena, Vol. 195, pp. 277-279, 2013
Online since
December 2012
Authors
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Price
$35.00
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