Effect of Sintering Process on Microstructures and Dielectric Properties of Nb-Doped BaTiO₃-(Bi_0.5Na_0.5)TiO₃ Ceramics for X9R MLCC Applications

Abstract:

Multilayer ceramic capacitor (MLCC) chips have been successfully prepared through tape-casting and screen-printing. Conventional sintering method and two-step sintering method with different sintering temperature and holding time are used to obtain the MLCC chips. The scanning electron microscopes show that MLCC chips sintered by two-step sintering at T₁=1200°C and T₂=1130°C for 3h have a highly dense dielectric layer. The temperature coefficient of capacitance (TCC) of the MLCC chip is less than ±15% from-60°C to 235 °C that satisfactorily meets the requirement of X9R. The average capacitance and the dielectric loss of the MLCC chip are 88nF and 1.8% at the room temperature, respectively.

• Periodical: Solid State Phenomena (Volume 281)
• Pages: 634-639
• DOI: https://doi.org/10.4028/www.scientific.net/SSP.281.634
• Online since: August 2018
• Authors: L.L. Chen, Zheng Bo Shen, Qian Cheng Zhao, Zi Ming Cai, Xiao Hui Wang*, Long Tu Li
• Keywords: Core-Shell Structure, Multilayer Ceramic Capacitor (MLCC), Two Step Sintering, X9R

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