Experimental Wafer Carrier Contamination Analysis and Monitoring in Fully Automated 300 mm Power Production Lines

Clara Zängle; Markus Pfeffer; Peter Franze; Germar Schneider; Anton J. Bauer

doi:10.4028/www.scientific.net/SSP.314.34

Paper Titles

Characterization and Removal of Metallic Contamination in H₂O and H₂O₂ Using Single Particle Inductively Coupled Plasma Mass Spectrometry
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Direct Analysis of Ultra Trace Metallic Particles in NH₃ and HCl Gases by Gas Exchange Device (GED)-ICP-MS
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Investigation of Contaminants in Single Wafer Wet Cleaning Using Isopropyl Alcohol
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Cl-Containing Microplastics from the Environment
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Experimental Wafer Carrier Contamination Analysis and Monitoring in Fully Automated 300 mm Power Production Lines
p.34

Wafer Container Monitoring Concerning Airborne Molecular Contaminations along a 300 mm Power Semiconductor Production Flow
p.41

Towards Si-Cap-Free SiGe Passivation: Impact of Surface Preparation on Low-Pressure Oxidation of SiGe
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Wet Chemical Cleaning of Organosilane Monolayers
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Reaction Kinetics of Poly-Si Etching in TMAH Solution
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HomeSolid State PhenomenaSolid State Phenomena Vol. 314Experimental Wafer Carrier Contamination Analysis...

Experimental Wafer Carrier Contamination Analysis and Monitoring in Fully Automated 300 mm Power Production Lines

Abstract:

Contamination control is essential in semiconductor manufacturing to ensure high yield and product quality. Latest power electronic devices are manufactured in fully automated 300 mm production lines, which utilize closed wafer containers called Front Opening Unified Pods (FOUPs). It has been observed, that FOUPs capture airborne molecular contaminants (AMC) outgassing from processed wafers or being transferred from the equipment minienvironment. These AMC might be released afterwards and can lead to defects causing yield and/or reliability issues of the power devices. Specific FOUP cleaning and exchange rules are already being utilized in the fab. But so far, these rules are not validated or adapted by actual concentration values in the FOUPs. In this paper, contamination levels in FOUPs are investigated to identify the sources of different AMC. The contamination data is analysed together with FOUP logistics data in order to establish an optimized FOUP management strategy. In the first part, in-line carrier contamination control is explained and a general overview of the AMC detected is given. In the second part, the data-driven FOUP-monitoring is described using the example of the root cause analysis of hydrofluoric acid (HF) contamination.

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Periodical:

Solid State Phenomena (Volume 314)

Pages:

34-40

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.314.34

Citation:

Cite this paper

Online since:

February 2021

Authors:

Clara Zängle*, Markus Pfeffer, Peter Franze, Germar Schneider, Anton J. Bauer

Keywords:

Airborne Molecular Contamination, FOUP Environment, Materials Handling, Product Yield

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Creative Commons CC BY 4.0

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* - Corresponding Author

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