Cl-Containing Microplastics from the Environment

D. Martin Knotter; Pradeep Sharma; Leon Goumans

doi:10.4028/www.scientific.net/SSP.314.29

Paper Titles

Surface Cleaning Challenges for Organic Light Emitting Diodes
p.3

Characterization and Removal of Metallic Contamination in H₂O and H₂O₂ Using Single Particle Inductively Coupled Plasma Mass Spectrometry
p.9

Direct Analysis of Ultra Trace Metallic Particles in NH₃ and HCl Gases by Gas Exchange Device (GED)-ICP-MS
p.17

Investigation of Contaminants in Single Wafer Wet Cleaning Using Isopropyl Alcohol
p.23

Cl-Containing Microplastics from the Environment
p.29

Experimental Wafer Carrier Contamination Analysis and Monitoring in Fully Automated 300 mm Power Production Lines
p.34

Wafer Container Monitoring Concerning Airborne Molecular Contaminations along a 300 mm Power Semiconductor Production Flow
p.41

Towards Si-Cap-Free SiGe Passivation: Impact of Surface Preparation on Low-Pressure Oxidation of SiGe
p.49

Wet Chemical Cleaning of Organosilane Monolayers
p.54

HomeSolid State PhenomenaSolid State Phenomena Vol. 314Cl-Containing Microplastics from the Environment

Cl-Containing Microplastics from the Environment

Abstract:

One of the critical process steps in the assembly of integrated circuits is the making of the connection between the silicon chip and the outside world. This is done by a thermo-sonic welding process of sometimes more than 800 copper wires to the aluminum bond pads. The Al-Cu intermetallic compound formed during this process is sensitive for trace amount of chloride from the environment. It is found that Cl-containing microplastics are the source of this chloride and further analyzing these particles helps to identify the origin of these particles.