Reduction of Process Chemicals and Energy Use in Single-Wafer Process Applications

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Abstract:

The semiconductor industry is a significant consumer of water and chemicals. In particular, water is a valuable resource, and its efficient use is crucial to ensure availability for future generations. By implementing measures to reduce water and chemical consumption, the semiconductor industry can minimize its environmental footprint and contribute to sustainability efforts. Technology for the recycling of unused hot ultrapure water (H-UPW), ozonated water and reclaimed sulfuric acid-hydrogen peroxide mixtures (SPM) has been developed and installed in high-volume manufacturing (HVM) semiconductor manufacturing facilities. This paper presents an overview of the technology and expected savings in water, sulfuric acid and energy consumption from the implementation of these technologies.

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Solid State Phenomena (Volume 346)

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296-301

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August 2023

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© 2023 Trans Tech Publications Ltd. All Rights Reserved

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[1] Information on https://spectrum.ieee.org/fabs-cut-back-water-use.

Google Scholar

[2] Submitted to Water & Energy Management subchapter in International Roadmap for Devices and Systems 2023 Update.

Google Scholar

[3] M. Meuris, P.W. Mertens, A. Opdebeeck, H.F. Schmidt, M. Depas, G. Vereecke, M.M. Heyns, and A. Philipossian, "The IMEC clean: A new concept for particle and metal removal on Si surfaces," Solid State Technology July 1995, 109-113.

Google Scholar

[4] H. Morita, T. Ii, J. Ida and T. Ohmi, "Total Room Temperature Wet Cleaning Process Based on Specific Gases Dissolved Ultrapure Water," Electrochemical Society Proceedings 99-36, 45-50 (1999).

DOI: 10.1109/issm.1999.808834

Google Scholar

[5] I. Kashkoush and R. Novak, "Optimization of Deionized Water Consumption in Wafer Wet Processing," Solid State Phenomena 65-66, 49-52 (1999).

DOI: 10.4028/www.scientific.net/ssp.65-66.49

Google Scholar

[6] F. Tardif, F. de Bourmont, T. Vareine, V. Oravec and A. DiMartino, "A Novel Rinsing Tank Concept to Save DI Water Using an Internal Recirculation Flow: 'Circle Stream Rinser'," Solid State Phenomena 76-77, 191-194 (2001).

DOI: 10.4028/www.scientific.net/ssp.76-77.191

Google Scholar

[7] K. Sano, A. Izumi, A. Eitoku, J. Snow, L. Nyns, S. Kubicek, R. Singanamalla, O. Richard, T. Conard, R. Vos and P.W. Mertens, "Single-Wafer Wet Chemical Oxide Formation for Pre-ALD High-k Deposition on 300 mm Wafer," Solid State Phenomena 134, 53-56 (2008).

DOI: 10.4028/www.scientific.net/ssp.134.53

Google Scholar

[8] D. Maloney, "Review of Gases & Chemicals by Process Module," Business of Cleans 2022, October 19, 2022, Phoenix.

Google Scholar

[9] J. Snow, H. Masayuki, S. Nobuyuki and E. Toru, "Towards Sustainable Fab: Reducing Bulk Chemicals by SPM Reuse in Single-Wafer Process Applications," SEMICON Europa Tech Arena, November 17, 2022, Munich.

Google Scholar

[10] Y. Okuno, "Sustainability Driven Innovation: transistor scaling and defectivity targets for sustainable manufacturing," SEMICON Europa Tech Arena, November 17, 2022, Munich.

Google Scholar

[11] P. Kerr and R. Tanaka: submitted for presentation to Ultrapure Micro Conference 2023, October 10-12, 2023, Austin.

Google Scholar

[12] C. Miller, H. Masayuki, S. Nobuyuki, and E. Toru, "Recycling of SPM in Single-Wafer Process Applications," Ultrapure Micro 2022, September 28-30, 2022, Phoenix.

Google Scholar