Quality Improvement of SiC Substrate Surface with Using Non-Abrasive CMP Slurry

Seung Jun Lee; Byeong Hun Park; Cheol Ho Lee; In Kyu Lee; Jung Doo Seo; Kap Ryeol Ku; Bo Hyeok Choi; Eun Ock Kim; Na Ra Shin; Su Yeong Jung; Dong Wook Kim; Jun Hyuck Na; Won Jae Lee

doi:10.4028/p-5Hf8bN

Paper Titles

Demonstration of Low Interface Trap Density (~3×10¹¹eV^-1cm^-2) SiC/SiO₂ MOS Capacitor with Excellent Performance Using H₂+NO POA Treatment for SiC Power Devices
p.151

Increasing Mobility in 4H-SiC MOSFETs with Deposited Oxide by In-Situ Nitridation of SiC Surface
p.157

Demonstrating SiC In Situ Rounded Trench Processing Technologies for Future Power Trench MOSFET Applications
p.163

High Mobility 4H-SiC P-MOSFET via Ultrathin ALD B₂O₃ Interlayer between SiC and SiO₂
p.171

Quality Improvement of SiC Substrate Surface with Using Non-Abrasive CMP Slurry
p.181

Addition of Transition Metal Ion CMP Slurry for Forming Ultra-Flat SiC Crystal
p.187

Increasing 4H-SiC Trench Depth by Improving the Dry Etch Selectivity towards the Oxide Hard Mask
p.193

A Comparison between Different Post Grinding Processes on 4H-SiC Wafers
p.201

Influence of Active Area Etching Method on the Integrity of Gate Oxide on 4H-SiC
p.211

HomeSolid State PhenomenaSolid State Phenomena Vol. 359Quality Improvement of SiC Substrate Surface with...

Quality Improvement of SiC Substrate Surface with Using Non-Abrasive CMP Slurry

Abstract:

Transition metal ion was added to CMP (chemical-mechanical polishing) slurry without abrasive particle to solve the problem of CMP. MRR (material removal rate) value of SiC substrate processed using non-abrasive slurry was comparable to MRR values of SiC substrates using abrasive slurries. The scratch formation was successfully suppressed in SiC substrate polished with using non-abrasive slurry and no residual particle resulting from agglomeration of abrasive particles could suppress scratches and forms a good quality of SiC substrate surface. Uniform and high-quality SiC substrates could be prepared through the non-abrasive CMP process.

By email View Pdf

You might also be interested in these eBooks