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Paper Titles
Preface
Trends and Challenges for Advanced Silicon Technologies
p.1
Needs of Low Thermal Budget Processing in SiGe Technology
p.17
History and Future of Semiconductor Wafer Bonding
p.33
Building the Electron Superhighway: Back-End Processing and Simulation
p.45
Role of Interstitial Atoms in Microscopic Processes on (113) and (001) Surfaces of Silicon
p.57
Silicon Materials and Metrology: Critical Concepts for Optimal IC Performance in the Gigabit Era
p.65
Expected Limits for Manufacturing Very Large Silicon Wafers
p.97
Diameter Effects on Grown-In Defects in CZ Crystal Growth
p.107

Trends and Challenges for Advanced Silicon Technologies

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Periodical:

Solid State Phenomena (Volumes 47-48)

Pages:

1-16

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.47-48.1

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Online since:

July 1995

Authors:

Cor Claeys, L. Deferm

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© 1996 Trans Tech Publications Ltd. All Rights Reserved

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