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HomeSolid State PhenomenaSolid State Phenomena Vols. 47-48History and Future of Semiconductor Wafer Bonding

History and Future of Semiconductor Wafer Bonding

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Gettering and Defect Engineering in Semiconductor Technology VI

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Periodical:

Solid State Phenomena (Volumes 47-48)

Pages:

33-44

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.47-48.33

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Online since:

July 1995

Authors:

U.M. Gösele, H. Stenzel, Manfred Reiche, T. Martini, H. Steinkirchner, Q.-Y. Tong

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© 1996 Trans Tech Publications Ltd. All Rights Reserved

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