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Helium Bubble Growth in Silicon: Ripening or Bubble Motion and Coalescence?
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HomeSolid State PhenomenaSolid State Phenomena Vols. 82-84Impact of Compressive Stress on the Formation of...

Impact of Compressive Stress on the Formation of Thermal Donors in Heat-Treated Silicon

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Gettering and Defect Engineering in Semiconductor Technology IX

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Periodical:

Solid State Phenomena (Volumes 82-84)

Pages:

259-266

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.82-84.259

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Online since:

November 2001

Authors:

Andrzej Misiuk, Boris A. Andreev, Valentin V. Emtsev, Charalamos A. Londos, Gagik A. Oganesyan, D.S. Poloskin

Keywords:

Compressive Stress, Heat Treatment, Oxygen Aggregation, Silicon, Thermal Donor

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© 2002 Trans Tech Publications Ltd. All Rights Reserved

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