Ion Implanted Nanolayers in AlN for Direct Bonding with Copper
Experiments to directly bond AlN with Cu were conducted for different pre-treatments of the bonded components. AlN substrates were implanted either with oxygen, or titanium or iron ions at low (15 keV) or high (70 keV) energy, or thermally oxidized. Some Ti-implanted samples were also thermally oxidized. The copper component was annealed and thermally oxidized. The best results, with respect to the bond shear strength, were obtained for low-energy implantation of oxygen and titanium.
Witold Lojkowski and John R. Blizzard
J. Piekoszewski et al., "Ion Implanted Nanolayers in AlN for Direct Bonding with Copper", Solid State Phenomena, Vols. 99-100, pp. 231-234, 2004