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Although the random orientation of crystals in polycrystalline diamond increased the strength and toughness on a certain scale, with the development of the machining and drilling industries, there has been the increasing demand and hopes that the PCD tool manufacturers are expected to eventually develop products with higher toughness, more shock resistant and less thermal degradation, so that it can prevent chip formation at the cutting edge while cutting hard materials like Al-20%Si alloy or can suffer higher impact strength and thermal degradation while drilling hard rock like granite.
Therefore CNTs are predicted to be the only highest modulus material which can form strong covalent bond to diamond [16] and the compounding between diamond and CNTs would impart this material with both high hardness and high toughness.
This paper aimed at investigating the unique structure and mechanical properties of the sintered diamond reinforced by diamond -MWCNTs composite fibers.
Tang: Chinese Journal of High Pressure Physics (3)(1992), pp.192-197 [9] M.V.
Jing: Chinese Journal of High Pressure Physics Vol.15(1)(2001), pp.1-3 [15] B.

The present work is mainly aimed to introduce the characterization methods and potential applications of graphene modified anticorrosive coating for tubing.
These studies are focused on the evolution of the microstructure of graphene coating during the experiment was determined by the variety of element compound before and after the modification of graphene and solidification of graphene coating at the marine environment simulating condition.
Acknowledgements This work received the support of the Basic research and Strategic reserve Technology Fund of CNPC (2017Z-04): Applied basic research on the application of graphene technology on the surface treatment of tubing ,Major science and technology projects of Petro China Co Ltd (2018E-11-06): Key technologies for improving development level in complex fault block oilfield at high water cut stage, and The scientific research and technology development project of CNPC(2018D-5010-08): Development of 720MPa titanium alloy drill pipe.
Journal of the Graduate School of Sun Yat-sen University. 29 (2008) 54-61
The Chinese Journal of Nonferrous Metals. 21 (2011) 165-70

Chromium compounds are contained in wastewater from electroplating industries formed during chromium plating, during chemical etching and surface passivation of parts made of ordinary, galvanized and cadmium steel, copper alloys during electro-polishing of steel parts, and during electrochemical anodizing of aluminum parts.
Journal of chemistry,(2020)
Journal Water Processing Engineering, 10(2016) 56–66
Journal of Hazardous materials, 112(2004) 207 – 213
Journal of Water Process Engineering, 33(2020)

When smelting of these ores that are mined for their metals , arsenic and arsenical compounds could enter the effluent in the dissolved form through industrial discharges from metallurgical industries[2].
The new substances on the surfaces of iron chips might be alloy, elemental metal , metal oxides and arsenates, it could be presumed.
Seen from Fig.13, it confirmed that many Cu(II) were displaced and removed from the copper smelting effluent, which had new states of element metal, alloy and oxides.
Table.2 Removal rate under optimal conditions of the combined process Species Total arsenic COD Cu2+ Pb2+ Ni2+ Fe2+ Fe3+ Initial content (mg·L-1) 153.0 146.4 104.5 74.8 15.5 391.3 97.4 Residual content(mg·L-1) 0.43 10.98 1.24 1.32 0.08 1.72 0.94 Efficiency (%) 99.7 92.5 98.8 98.2 99.5 99.6 99.0 Conclusions The current study aimed at evaluate the efficiency of arsenic removal from copper smelting effluent.
Hu: Journal of Tianjin Polytechnic University Vol. 28(2009), p.62 [6] H.

The aeronautic industries always have been a source and driving force for the development of new materials and material compounds.
The aim of this research is to define a set of relevant parameters for the characterization of selected SMs systems (e.g. steel/ polymer/steel) developed for reducing noise, heat transfer or vibrations as well as weight in automotive, naval industries, building applications, etc.
Data: mean ± SD (n = 5) The mechanical properties of the polymer (PP-PE foil), the metal (steel and aluminium alloys) and their interface determine the strength of the sandwich.
Fleck, International Journal of Mechanical Sciences, 46 (4) (2004), p.585608

However, they are particularly susceptible to localized corrosion by chloride and reducing sulfur compounds[6].
Journal of Separation Science.
Journal of Coatings Technology and Research.
Polymer Journal.
Journal Physical Chemistry.

Clearly, in the development of new electronic packages, the aim is to lower the cost, increase the packaging density, and to improve the performance while still maintaining or even improving the reliability of the components.
The results of these reactions by diffusion are intermetallic compounds (e.g., Cu6Sn5 or Cu3Sn, [4]), which form in a characteristic scallop-like shape and ripen to become relatively thick intermetallic layers: right inset of Fig. 3.
Moreover it represents a nonlinear partial differential equation (PDE) of 4th order which describes the temporal development of α- and β-phases in a binary alloy A-B [5,6].
Rather there is a supply of grain material due to the interfacial reactions between the solder alloy and the copper.
Müller: International Journal of Solids and Structures, Vol. 37 (2000), pp. 3841-3871

The results offer practical insights for electronics manufacturers aiming to improve process throughput and reliability in advanced packaging by selecting suitable nanoparticle-enhanced underfill formulations.
The aim of this research is to conduct data-driven optimization of nanoparticles-reinforced underfill encapsulation in Ball Grid Array (BGA) Assemblies through the investigation of the impact of nanoparticle materials and their weighted percentages.
Ramli, Investigation of the Impacts of Solder Alloy Composition and Temperature Profile on Fatigue Life of Ball Grid Array Solder Joints Under Accelerated Thermal Cycling, Journal of Electronic Packaging, 147(1), 2025a. https://doi.org/10.1115/1.4065805
Liang, Modeling and simulation of underfill flow in flip-chip assemblies, Journal of Electronic Packaging, 134(2), 020901, 2012
Ramli, Thermal fatigue life prediction and intermetallic compound behaviour of SAC305 BGA solder joints subject to accelerated thermal cycling test, Soldering and Surface Mount Technology, 36(3), 154–164, 2024. https://doi.org/10.1108/SSMT-12-2023-0075

The global LED market is projected to grow at a compound annual growth rate (CAGR) of 12.5% during the forecast period from 2021 to 2028 [2].
To enable the mass production, current research aims at replicating several lenses in one press cycle using wafer-scale concepts.
Fig. 4 Process chain of the wafer scale process In nonisothermal glass molding, high-alloy steels or alloys with high chromium and nickel contents are used in general [14].
Bergs, Machine learning-based predictive modeling of contact heat transfer, International Journal of Heat and Mass Transfer 174 (2021) 121300. https://doi.org/10.1016/j.ijheatmasstransfer.2021.121300
Khoo, An LCA study of a primary aluminum supply chain, Journal of Cleaner Production 13 (2005) 607–618. https://doi.org/10.1016/j.jclepro.2003.12.022.

Aereal uses Alloy, a first-order relational language, ACME for architecture description, and their associated tool sets.
Based on the principles mentioned above and the universal classification and comparison frame of ADL in Reference [3], aiming at the exception handling of architecture layer, the paper abstracts the SOA supporting exception handling(as shown in Fig.1).
If a message type has a complex data structure, namely, it is compounded by many simple data types.
StructuredAction is an action compounded by multi-action according certain temporal relations.
a) Spring, Berlin 2009 [6] S.L.Marcos, Z.Qayyum , “Representing service-oriented architectural models using pi-adl”, ECSA 2008,LNCS 5292, pp.273-280 [7] YANG Xin, CHEN Jun-Liang, “An Architecture Description Language for Web Services Component System”, Journal of Software.2006,17(005), pp,1182-1194 [8] Rao Yuan, Feng-Boqing and Li-Zunchao, “ALBC4WS:A Dynamic Service Composition Framework Based on the software Architecture Lifecycle”, Journal of Computer Research and Development.2005,42(02), pp.2063-2069 [9] Xiangyang Jia, Shi Ying et al, “A New Architecture Description Langu-age for Service-Oriented Architecture”, In proceeding of Sixth Internation-Conference on Grid and Cooperative Computing(GCC 2007).16-18 Aug, 2007, pp.96-103 [10] JIANG-Zheyuan, HAN-Jianghong ,WANG Zhao, “Service-oriented Software Architecture Description and Construction Using XML”,Journal of Chinese Computer Systems,2008,29(8), pp.1437-1444 [11] F.F.Castor, P.H.Brito, C.M.Rubira, “Specification of exception