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Online since: February 2011
Authors: Grzegorz Boczkal
The orientation of the grown single crystals was measured at Bruker Advance D-8 diffractmeter.
Dziędziel: Problems of modern techniques inaspect of engineering and education, eds.: Paweł Kurtyka [et al.] ; PU IT.— (Monography /Pedagogical University.
Institute of Technology), pp.61–65 (2006) [8] G.Boczkal, M.Mikułowski, W.Wołczyński: Oscillatory structure of the Zn-Cu-Ti single crystals, Mat.Sci.Forum 649, pp113-118, (2010) [9] W.Wołczyński, B.Mikułowski, G.Boczkal: Control of the single crystal reinforcement by the intermetallic compound layers, Mat.Sci.Forum 649, pp.125-130, (2010) [10] G.Boczkal, B.Mikułowski, I.Hunsche, C.G.Oertel, W.Skrotzki: Precipitation of intermetallic phase in Zn-Ti alloy single crystals, Cryst.
Dziędziel: Problems of modern techniques inaspect of engineering and education, eds.: Paweł Kurtyka [et al.] ; PU IT.— (Monography /Pedagogical University.
Institute of Technology), pp.61–65 (2006) [8] G.Boczkal, M.Mikułowski, W.Wołczyński: Oscillatory structure of the Zn-Cu-Ti single crystals, Mat.Sci.Forum 649, pp113-118, (2010) [9] W.Wołczyński, B.Mikułowski, G.Boczkal: Control of the single crystal reinforcement by the intermetallic compound layers, Mat.Sci.Forum 649, pp.125-130, (2010) [10] G.Boczkal, B.Mikułowski, I.Hunsche, C.G.Oertel, W.Skrotzki: Precipitation of intermetallic phase in Zn-Ti alloy single crystals, Cryst.
Online since: April 2021
Authors: Risdiana Risdiana, Fitrilawati Fitrilawati, Norman Syakir, Iman Rahayu, Soni Setiadji, Atiek Rostika Noviyanti, Zulfi Mofa Agasa, Diba Grace Auliya, Asep Supriadin
Vijayasekaran, et al, Synthetic polymers as materials for artificial vitreous body: review and recent advances, J.
Safriani, Risdiana, Characterization of Optical and Structure Properties of Polydimethylsiloxanes, Materials Science Forum 827 (2015) 99-104
Forum 966 (2019) 189-193
Rahayu, Risdiana, Synthesis of Polydimethylsiloxane and its Monomer from Hydrolysis of Dichlorodimethylsilane, Key Engineering Materials 860 (2020) 234-238.
Safriani, Risdiana, Characterization of Optical and Structure Properties of Polydimethylsiloxanes, Materials Science Forum 827 (2015) 99-104
Forum 966 (2019) 189-193
Rahayu, Risdiana, Synthesis of Polydimethylsiloxane and its Monomer from Hydrolysis of Dichlorodimethylsilane, Key Engineering Materials 860 (2020) 234-238.
Online since: January 2016
Authors: Daniel Urbán, Peter Tomašovič
ANALYSIS OF THE CAVITY OF DOUBLE TRANSPARENT FACADES, PART 1. . in 23rd Annual PhD Student Conference on Architecture and Construction Engineering, Building Materials, Structural Engineering, Water and Environmental Engineering, Transportation Engineering, Surveying, Geodesy, and Applied Mathematics. 2013.
Acoustics of double transparent facades, Faculty of Civil Engineering Bratislava. in Nové trendy akustického spektra 2013.
Advanced Building Construction and Materials 2013, 2013. 855: p. 241-244
Fórum Architektúry 2011; Available from: http://www.sasarch.sk/db_suborov/390.pdf
STANDING WAVES IN THE CAVITY OF DOUBLE TRANSPARENT FACADES. in 7th Forum Acusticum. . 2014.
Acoustics of double transparent facades, Faculty of Civil Engineering Bratislava. in Nové trendy akustického spektra 2013.
Advanced Building Construction and Materials 2013, 2013. 855: p. 241-244
Fórum Architektúry 2011; Available from: http://www.sasarch.sk/db_suborov/390.pdf
STANDING WAVES IN THE CAVITY OF DOUBLE TRANSPARENT FACADES. in 7th Forum Acusticum. . 2014.
Online since: January 2010
Authors: Comondore Ravindran, Lukas Bichler
Introduction
Casting magnesium alloys has significantly advanced over the past few decades [1].
Acknowledgement The authors would like to acknowledge the financial support of the National Science and Engineering Research Council (NSERC) of Canada.
Machin of Ryerson University for engineering assistance and Mr.
Caulk, Analysis of liquid metal flow in die casting, UInternational Journal of Engineering ScienceU, Vol. 38 (2000), pp. 1279 - 1302
Westengen, Die casting for high performance - Focus on alloy development, UAdvanced Engineering MaterialsU, Vol. 5, No. 12 (2003), pp. 879 - 885
Acknowledgement The authors would like to acknowledge the financial support of the National Science and Engineering Research Council (NSERC) of Canada.
Machin of Ryerson University for engineering assistance and Mr.
Caulk, Analysis of liquid metal flow in die casting, UInternational Journal of Engineering ScienceU, Vol. 38 (2000), pp. 1279 - 1302
Westengen, Die casting for high performance - Focus on alloy development, UAdvanced Engineering MaterialsU, Vol. 5, No. 12 (2003), pp. 879 - 885
Online since: March 2013
Authors: Wei Li, Ying Li
Construction Management is a special course offered to students whose major is Civil Engineering.
In our institution, this course targets undergraduate students, whose major is Civil Engineering.
It is one of special courses offered to students whose major is Civil Engineering.
Construction of the course Adjustment of the content of Civil Engineering.
Conclusions This course is offered to undergraduate students, whose major is Civil Engineering.
In our institution, this course targets undergraduate students, whose major is Civil Engineering.
It is one of special courses offered to students whose major is Civil Engineering.
Construction of the course Adjustment of the content of Civil Engineering.
Conclusions This course is offered to undergraduate students, whose major is Civil Engineering.
Online since: March 2014
Authors: Deng Yu Li, Jun Xiao, Xiao Xu Leng
The reconstruction results can be used in engineering calculation.
As a special object, rock mass is difficult to measure and reconstruct but important for engineering calculation.
Wei: Point Cloud Data Acquisition Based on Reverse Engineering Technology.
Computer Graphics Forum, Vol. 26(2) (2007), p. 214-226
The 2013 2nd International Conference on Computer, Mechatronics, Control and Electronic Engineering.
As a special object, rock mass is difficult to measure and reconstruct but important for engineering calculation.
Wei: Point Cloud Data Acquisition Based on Reverse Engineering Technology.
Computer Graphics Forum, Vol. 26(2) (2007), p. 214-226
The 2013 2nd International Conference on Computer, Mechatronics, Control and Electronic Engineering.
Online since: December 2024
Authors: Tian Hong Gu, Shu Wei Jiang, Wen Su
Tensile Properties, Strain Rate Sensitivity and Microstructural Analysis of SN100C Solder Alloys
Tianhong Gu1,a, Shuwei Jiang1,b, Wen Su1,c
1Advanced Materials Research Centre (AMRC) and Department of Civil Engineering, Design School, Xi’an Jiaotong-Liverpool University, Suzhou, Jiangsu, 215123, China.
References [1] Cheng S, Huang C-M, Pecht M 2017 Microelectronics Reliability 75 77 [2] Nogita K, Greaves M C, Guymer B D, Walsh B B, Kennedy J M, Duke M D, Nishimura T 2010 Transactions of The Japan Institute of Electronics Packaging 3 104 [3] Lin Y-W, Lin K-L 2013 Intermetallics 32 6 [4] Moon K-W, Boettinger W J, Kattner U R, Biancaniello F S, Handwerker C 2000 Journal of electronic materials 29 1122 [5] Yokoi M, Kobayashi T, Shohji I Materials Science Forum p2081-2086 [6] Schwartz M 2014 Soldering: Understanding the basics (ASM International) [7] Lai Y-S, Song J-M, Chang H-C, Chiu Y-T 2008 Journal of Electronic Materials 37 201 [8] Hidaka N, Watanabe H, Yoshiba M 2009 Journal of electronic materials 38 670 [9] Hasnine M, Vahora N 2018 Journal of Materials Science: Materials in Electronics 29 8904 [10] Yang T 2007 Master's thesis, Harbin University of Science and Technology
[11] Azman D I N A, Osman S A, Narayanan P, Kozutsumi Y 2024 Journal of Advanced Research in Micro and Nano Engineering 17 69 [12] Yi J, Zhang Y, Xu L, Liu S, Yang Y 2017 Electronic Components and Materials 31(3) 49-52
[13] Yahaya M Z, Mohamad A A 2017 Soldering & Surface Mount Technology 29 203 [14] Pang J H L 2011 Lead Free Solder (Springer) [15] Kim J-W, Kim D-G, Jung S-B 2005 Metals and Materials International 11 121 [16] Tada N, Nishihara R, Masago H 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) p145-148 [17] Jang W-L, Wang T-S, Lai Y-F, Lin K-L, Lai Y-S 2012 Microelectronics Reliability 52 1428 [18] Nogita K, Salleh M A M, Smith S, Wu Y, McDonald S D, Razak A G A, Liu S, Akaiwa T, Nishimura T 2017 Transactions of The Japan Institute of Electronics Packaging 10 E17 [19] Izwan Ramli M I, Saud N, Mohd Salleh M A A, Derman M N, Said R M, Nasir N 2015 Applied Mechanics and Materials 754 513 [20] Izwan Ramli M I, Saud N, Mohd Salleh M A A, Derman M N, Said R M, Nasir N Materials Science Forum p161-166 [21] Johansson J, Belov I, Johnson E, Dudek R, Leisner P 2014 Microelectronics Reliability 54 2523 [22] George.E., Das.D., Osterman.M.,
Pecht.M. 2011 Transcations on Device and Materials Reliability 11 328 [23] Kanlayasiri K, Kongchayasukawat R 2018 Transactions of Nonferrous Metals Society of China 28 1166 [24] Ma H, Suhling J C J J o m s 2009 44 1141 [25] Abtew M, Selvaduray G 2000 Materials Science and Engineering: R: Reports 27 95 [26] Bai N, Chen X, Fang Z 2008 Journal of electronic materials 37 1012 [27] Xu Y, Gu T, Xian J, Giuliani F, Britton T B, Gourlay C M, Dunne F P 2022 Materials Science and Engineering: A 855 143876 [28] Shohji I, Yoshida T, Takahashi T, Hioki S 2004 Materials Science and Engineering: A 366 50 [29] El-Taher A, Abd Elmoniem H, Mosaad S 2023 Journal of Materials Science: Materials in Electronics 34 590 [30] Zhu F, Zhang H, Guan R, Liu S, Yang Y 2006 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits p239-243
References [1] Cheng S, Huang C-M, Pecht M 2017 Microelectronics Reliability 75 77 [2] Nogita K, Greaves M C, Guymer B D, Walsh B B, Kennedy J M, Duke M D, Nishimura T 2010 Transactions of The Japan Institute of Electronics Packaging 3 104 [3] Lin Y-W, Lin K-L 2013 Intermetallics 32 6 [4] Moon K-W, Boettinger W J, Kattner U R, Biancaniello F S, Handwerker C 2000 Journal of electronic materials 29 1122 [5] Yokoi M, Kobayashi T, Shohji I Materials Science Forum p2081-2086 [6] Schwartz M 2014 Soldering: Understanding the basics (ASM International) [7] Lai Y-S, Song J-M, Chang H-C, Chiu Y-T 2008 Journal of Electronic Materials 37 201 [8] Hidaka N, Watanabe H, Yoshiba M 2009 Journal of electronic materials 38 670 [9] Hasnine M, Vahora N 2018 Journal of Materials Science: Materials in Electronics 29 8904 [10] Yang T 2007 Master's thesis, Harbin University of Science and Technology
[11] Azman D I N A, Osman S A, Narayanan P, Kozutsumi Y 2024 Journal of Advanced Research in Micro and Nano Engineering 17 69 [12] Yi J, Zhang Y, Xu L, Liu S, Yang Y 2017 Electronic Components and Materials 31(3) 49-52
[13] Yahaya M Z, Mohamad A A 2017 Soldering & Surface Mount Technology 29 203 [14] Pang J H L 2011 Lead Free Solder (Springer) [15] Kim J-W, Kim D-G, Jung S-B 2005 Metals and Materials International 11 121 [16] Tada N, Nishihara R, Masago H 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) p145-148 [17] Jang W-L, Wang T-S, Lai Y-F, Lin K-L, Lai Y-S 2012 Microelectronics Reliability 52 1428 [18] Nogita K, Salleh M A M, Smith S, Wu Y, McDonald S D, Razak A G A, Liu S, Akaiwa T, Nishimura T 2017 Transactions of The Japan Institute of Electronics Packaging 10 E17 [19] Izwan Ramli M I, Saud N, Mohd Salleh M A A, Derman M N, Said R M, Nasir N 2015 Applied Mechanics and Materials 754 513 [20] Izwan Ramli M I, Saud N, Mohd Salleh M A A, Derman M N, Said R M, Nasir N Materials Science Forum p161-166 [21] Johansson J, Belov I, Johnson E, Dudek R, Leisner P 2014 Microelectronics Reliability 54 2523 [22] George.E., Das.D., Osterman.M.,
Pecht.M. 2011 Transcations on Device and Materials Reliability 11 328 [23] Kanlayasiri K, Kongchayasukawat R 2018 Transactions of Nonferrous Metals Society of China 28 1166 [24] Ma H, Suhling J C J J o m s 2009 44 1141 [25] Abtew M, Selvaduray G 2000 Materials Science and Engineering: R: Reports 27 95 [26] Bai N, Chen X, Fang Z 2008 Journal of electronic materials 37 1012 [27] Xu Y, Gu T, Xian J, Giuliani F, Britton T B, Gourlay C M, Dunne F P 2022 Materials Science and Engineering: A 855 143876 [28] Shohji I, Yoshida T, Takahashi T, Hioki S 2004 Materials Science and Engineering: A 366 50 [29] El-Taher A, Abd Elmoniem H, Mosaad S 2023 Journal of Materials Science: Materials in Electronics 34 590 [30] Zhu F, Zhang H, Guan R, Liu S, Yang Y 2006 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits p239-243
Online since: October 2009
Authors: Hong Liang Li, Yue Fa Zhou, Xiang Chun Ji, Zhao Kui Zhang
Structural Design and the State of Motion Analyzes for
Multi-Degree-of-Freedom Electro-hydraulic Mix-drive Motion
Simulator
Zhou Yue-fa1,a , Ji Xiang-chun
2,b
, Li Hong-liang1,c
,Zhang Zhao-kui
1,d
1
College of Aerospace Engineering and Civil Engineering of Harbin Engineering University, China
2
Underwater Acoustic Engineering College of Harbin Engineering University, China
a
zhouyuefa@163.com,
b
jixc@sina.com,
clihongliang@hrbeu.edu.cn, d
zhangzhaokui58@163.com
Keywords: motion simulator; parallel turnplate; series turnplate; coordinate transformation;
Kinematics
Abstract.
Afterward, in the world, some countries with more advanced space technology had spent much energy in researching and manufacturing series turnplates, their developments had been achieved high level.
Stewart: A platform with six degree of freedom, in Proceedings of the Institution of Mechanical Engineering,Vol. 180(1965), No. 5,Part 1, p. 371-386
AHS International 64th Annual Forum, Proceedings, Vol. 3(2008),p.2390-2402
Proceedings of SPIE - The International Society for Optical Engineering, Vol. 4717(2002), p. 56-67
Afterward, in the world, some countries with more advanced space technology had spent much energy in researching and manufacturing series turnplates, their developments had been achieved high level.
Stewart: A platform with six degree of freedom, in Proceedings of the Institution of Mechanical Engineering,Vol. 180(1965), No. 5,Part 1, p. 371-386
AHS International 64th Annual Forum, Proceedings, Vol. 3(2008),p.2390-2402
Proceedings of SPIE - The International Society for Optical Engineering, Vol. 4717(2002), p. 56-67
Online since: October 2012
Authors: A.N. Idriss, S. Mridha, N.I. Taib
Idriss1,c
1 Advanced Materials and Surface Engineering Research Unit
Department of Manufacturing and Materials Engineering
International Islamic University Malaysia, P.O Box, 50728, Kuala Lumpur, Malaysia
ashahjahan@iium.edu.my, bnada.izyan@yahoo.co.uk, c ahmednazrin@gmail.com
Keywords: Low alloy steel, TIG torch, TiC and h-BN powder mixture, composite layer, hardness, microstructure.
Wear is a common problem for engineering components subjected to dynamic loading.
Introduction Most engineering components experience wear and tear when subjected to dynamic loading.
Engineering, 15 (1999) 210 [18] S.
Forum, 675-677 (2011) 783-787 [22] S.
Wear is a common problem for engineering components subjected to dynamic loading.
Introduction Most engineering components experience wear and tear when subjected to dynamic loading.
Engineering, 15 (1999) 210 [18] S.
Forum, 675-677 (2011) 783-787 [22] S.
Online since: September 2011
Authors: Xin Zheng Lu, Ai Zhu Ren, Xiao Lu, Zhen Xu
In the field of civil engineering, the visualization of FE spatial data is studied by some researchers [5-6].
Fig. 1 Flow of scene simulation of bridge collapse Open Scene Graph (OSG) is open source graphics engine with abundant advanced graphic function.
Bhandari: Structural Engineering International, Vol. 15(2005), p.166 [2] X.Z .Lu, L.P.
Zhang:Earthquake Resistant Engineering and Retrofitting, Vol.27 (2007),p.1 (In Chinese) [3] K.
Zheng: Chinese Journal of Rock Mechanics and Engineering, Vol.25 (2006), p.1015 (In Chinese)
Fig. 1 Flow of scene simulation of bridge collapse Open Scene Graph (OSG) is open source graphics engine with abundant advanced graphic function.
Bhandari: Structural Engineering International, Vol. 15(2005), p.166 [2] X.Z .Lu, L.P.
Zhang:Earthquake Resistant Engineering and Retrofitting, Vol.27 (2007),p.1 (In Chinese) [3] K.
Zheng: Chinese Journal of Rock Mechanics and Engineering, Vol.25 (2006), p.1015 (In Chinese)