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The reduction of the laser induced damage threshold is mainly due to the surface/subsurface processing damage on optical component.
Compare the above formula with the critical force in Eq. 2, therefore, the ratio r can be written as: (6) Since the rotation speed of the polishing wheel is not high during the processing, the dynamic pressure value formed on the surface of the optical element is relatively small, and the maximum ratio r obtained after substituting the relevant data is 1.3×10-5.

Compared with linear and logarithmic of the rogor removal efficiency and pulse frequency data, it is more consistent with al logarithmic relationship.
Reduction of the reaction system A NTP is a non-equilibrium plasma where free electrons as well as highly excited reactive atoms, ions, and molecules are created mostly from air constituents.

The raw material was rolled with the total reduction of about 63% and the final total thickness of cold rolling Cu/Al clad sheet was 6.2mm.
Dinsdale, SGTE data for pure elements.

Calibration of Strength Reduction Factor for Reinforced Ultra-High-Performance Concrete Bridge Girders in Flexure. 
Vine Copula Data Fusion for Failure Probability Analysis of Steel Bridge Girder Section. 

In a dynamic state, these changes are characterized by a dynamic storage modulus and a loss modulus (the ratio of stress to strain under vibration, calculated from data obtained from free or forced vibration, shear, compression, or elongation tests).
The combination of the properties of elastomer and MR fluids makes it possible to provide a gel-like material that supports sedimentation reduction and particle freedom to obtain a significant increase in viscosity when exposed to a magnetic field [12, 13].

Meanwhile, biodegradation acts like a catalyze for the reduction process that is found biologically in terms of chemical compounds’ complexity [3].
However, the bacterial biomass did not change either (data not shown) when using the powdered bioplastics.

SEM (scanning electron microscope) analysis of the AA2124/SiC/25p-T4 MMC showing: (a) base MMC, (b) weld zone [2] Regarding the microstructure of the composite materials with metallic matrix the following can be said: a better homogenization of the initial distribution of abrasive particles occurs, irrespective of rotational speed of particles type in FSW zone [6], [1], [2], [7], [14], particles were distributed more homogeneously in the WZ compared to those in the BM [7], the abrasive effect of the pin on the ceramic reinforcement led to a significant reduction of the size particles to the base MMC [12], [2], [3], [10] and grain refinement of the matrix aluminium alloy was observed [12].
A comparison of the tensile data and the microhardness profiles reveals the tendency of UTS corresponding very well with the tendency of hardness minima, which demonstrates the precipitate evolution caused by FSW thermal cycle determines both the microhardness distribution and tensile property of the joints [17].

Chemical and physical properties of nanosilica used in the research (developed on the basis of the material safety data sheet) SiO2 content min 99.8% Surface area 170±30 [m2/g] Bulk density 50 [g/l] pH, (4% aqueous dispersion) 3.5 – 5.5 Weight loss on ignition (2 h in 1000oC) 2.0% Weight loss after drying (2 h in 105oC) 0.6% Microsilica was used as microfiller.
Hosseini, Reduction of Cement Consumption by the Aid of Silica Nano-Particles (Investigation on Concrete Properties).

According to the literature data [10] the low water resistance of gypsum binders is explained by the high solubility of calcium sulfate dihydrate, which amounts to 2.04 g/dm3 CaSO4 at 20°С, its high permeability and the wedging action of water molecules at their penetration into intercrystalline spaces (Rehbinder effect).
At the same time the reduction of W/G requires adding plasticizing admixtures to provide the necessary flowability of the mix for the moulding technology or passing from conventional moulding methods to using harsher moulding mixtures and compressing technologies.

Photons, with a higher transmitting speed, a larger data conveying ability, and a lower interaction with each other, are believed to play a key role in next-generation information technology [1].
This can afford a significant reduction in aspects such as device dimension, cost, package complexity, light coupling, and power consumption.