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., size, and number of samples of Cubic compressive strength(CCS) tests of POC are listed in Table 1.
The compositions of C1 series were the high-grade silicon-cement (PII52.5) and one grain size distribution graded broken stone (basalt, metamorphic rock) with grain diameter between 10mm~20mm, The compositions of C2 series were the normal-grade silicon-cement (PII42.5) and one grain size distribution graded broken stone (sedimentary rock, limestone) with grain diameter between 10mm~20mm. "3×2×5" of group C1-1~5 means that 3 samples, 2 cement-consolidated time, total 5 groups.
From the data of Fig.4, Fig.5 and Table 2, the grain type had effect on the cubic compressive strength of Green-growing porous concrete.
The compressive strength of the broken stone of limestone is less than that of the broken stone basalt, and the destroy of the POC was a few of the destroy of stone grains, the stone grains take much part in the cubic compressive strength.
The grain type had effect on the cubic compressive strength of Green-growing porous concrete.

Table 2 The dispersing effects of different dispersants to α-Al2O3 powders Experimental Number 1 2 3 4 5 6 7 8 9 dispersant B1 + alcohol B1 + water B2 + alcohol B2 + water B3 + alcohol B3 + water B4 + alcohol B4 + water B5 + alcohol Suspension height /cm 1 1 1 14 1 13.1 1 1 1 Experimental Number 10 11 12 13 14 15 16 17 18 dispersant B5 + water B6 + alcohol B6 + water B7 + alcohol B7 + water B8 + alcohol B8 + water B9 + alcohol B9 + water Suspension height /cm 16 1 1 1 1 6 1 1 1 However, the α-Al2O3 powders are not dispersed effectively by the polyethylene glycol(M=400), tween, pelopon A, glycerol monoleate and softex kw, or precipitate to the colorimetric tube bottom via long time standing after being dispersed.
Table 3 The effects of temperatures on the stability of the α-Al2O3 powder dispersants emulsifiers 50°C 60°C 70°C 80°C 85°C PEG6000 + water stable stable small grains increasing Grains assembling and sinking gradually Colloid delaminating IW + alcohol stable stable the transparence increasing homogeneous colloid homogeneous colloid PEG 10000 +water stable grains appeared small grains increasing Grains assembling and sinking gradually colloid delaminating OP+water Assembling and sinking Table 3 shows that for heat resistance, polyethylene glycol(M=6000) is slightly superior to polyethylene glycol (M=10000) and OP-water solution is the worst among non-ion type surfactants tested in 3.1, but these three solutions had demulsified at 85°C.
It can be seen from Fig.1 that the α-Al2O3 powder grains distribute evenly in the plating coating plated with the optimized composite dispersant.
It indicates that the α -Al2O3 powder grains distribute homogeneously in plating solution which is stable.
(4) The XRD patterns and SEM images of the plating coating indicate that the α-Al2O3 powder grains distribute evenly in the amorphous plating coating which crystallized after heat treatment but the α-Al2O3 powder phase has not transformed.

In general, similar microstructure characteristics are observed in these samples, i.e. uniformly sized grains with a high degree of grain close-packing.
Almost no abnormal grain growth is observed.
The PMN-PT sample exhibits a relative homogeneous microstructure consisting of grains with grain size range between 1 and 6.5 µm (Fig. 1. a).
The size of the grains decreases with the increase in ST concentration (Fig. 1 c-b).
This is in good agreement with the ICDD number (033-0875, Table 1) and the observations presented by previous workers [3, 7].

No obvious grains can be observed on the surface for their poor crystallined quality.
As annealing temperature increase to 500°C, the average size of the crystalline grains decrease and the density of grains increases with facetted surface.
At low temperature in this process, the formation of the liquid-liked CuSe phase occurs and can be observed as large grains (Fig. 5 (b,c)) which corresponding to EDS analysis of region number 1, 2 in Fig. 5(b) as shown in Table 1.
The background (region 3, 4), the EDS results reveal that these region are deficient in selenium and the grains contain lower concentration of Cu element than that of region 1, 2.
As selenization temperature increases to 450°C, the large grain sizes (region 1, 2) with high Cu and Se content is converted to small dense grains (Fig. 5(c)) with slightly Cu-poor film.

These effects are the result of a transition in deformation mechanisms from grain-boundary-sliding (GBS) to dislocation-climb (DC) creep.
This is primarily because of low formabilities, a result of the limited number of slip systems available in the hexagonal-close-packed (HCP) crystal structure inherent to Mg [1].
The lineal-intercept grain size of this material was previously reported to be 5.6 µm in the as-received condition [7,8].
Some deformation twinning is evident in Fig. 1(d), which is most likely associated with a relatively large grain size.
This suggests increased GBS creep activity in AZ31B-SPR, as is expected from its finer grain size.

In a heavily rolled sample, the subdivision of original grains leads to a break-up into finely spaced texture components.
After 98% rolling (εvM=4.5) the large initial grain size was reduced to about 10 μm.
As an example, numbers for the stored energy in nickel cold deformed over a large strain range are given in Table 1 based on structural data from Refs [16,17].
Grain boundary EBSD maps for nickel (99.99%) deformed by high pressure torsion to εvM=100 and annealed.
Bate, in: Recrystallization and Grain Growth, Pts 1 and 2.

Only a limited number of studies have focused on the Low Cycle Fatigue (LCF) behavior of AM materials, such as maraging steel and Inconel 625 (IN625) superalloy.
(a) As built (AB) microstructure of M300 with different grain morphologies, ie, (I, II.
Stress amplitude Vs number of cycles for maraging steel (M300): (a) 0o oriented AB samples at different strain amplitudes (b) 90o oriented AB samples at different strain amplitudes.
Fig 4 (a, b) presents the variation of stress amplitude with number of cycles of maraging steel for as built and heat-treated samples.
Microstructure of M300 and IN625, both showed similar structure, cellular and columnar grains which transformed to fine martensite and equiaxed grains respectively, after heat treatment.

There were a very small number of samples the fail by an interfacial fracture between the two materials.
The grains in HAZ are fragmented as a result of their plastic deformation and in the same time, in the nugget zone, the grains are elongated, columnar, oriented along the direction of heat evacuation, specific to a material solidified from a melted material (fig. 8).
The central region of the nugget is characterized by long columnar grains, oriented perpendicular on the separation plane between the two welded plates.
The beginning of the nugget zone: a) x100 OM; b) x100 OM At a closer look on a joint between a thin plate (1.2mm) and a thicker one (2.5mm), it can be observed very clear the difference between the columnar aspect of the grains in the central region of the nugget and the fine grains of the HAZ (fig. 9.c), the transition between these zones consists of a layer of polygonal grains (with width around 3-5 grains) and is located mainly in the thicker plate.
A general image of the nugget zone in presented in fig. 10, reveals clearly the separation plane of the joint, on which the columnar grains are perpendicular.

Copper, on the other hand, partially wets WC, and thus gives rise to grain coarsening of WC.
 Prevention of the separation of pores from the grain boundaries in the final stage of sintering by adjusting the mobilities of the pores and the grain boundaries.
The detailed microstructural analysis of SiC doped with such additives showed clean grain boundaries in (B,C) doped materials , while (Al,C) doped materials revealed the presence of thin Al-containing grain boundary [35].
The steps involved are:  Deformation of powder creating a number of dislocations  Extremely dense dislocation structure resulting in grain sub-divisions
 Emergence of nano-grained structure with high angle boundaries.

While the number of instruction in the issue queue reduced, the number of non-ready operands woken up reduced and hence the power consumption reduced.
In [11] a compiler based technique that performs fine-grained issue queue throttling is presented.
This paper performs an extensive exploration of the compiler design space, showing the improvements available through both coarse-grained and fine-grained issue queue limiting.
Overall there is an average 21% reduction in the number of entries.
The compiler analyses the DAG of program and determines the number of issue queue entries needed by each basic block in a program and encodes this number in a special instruction (IQ_RESIZE) which is used to limit the number of instructions in the queue.