Books by Keyword: Diffusion

Description: Engineering materials have long been challenges to, as well as the foundations of, industries and technologies. New technologies and new devices become available largely through the introduction of new materials or the improvement of existing materials.
Volume is indexed by Thomson Reuters CPCI-S (WoS).

Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
No present-day research and development program is complete without the inclusion of a robust modeling and numerical simulation component. Models and model-based numerical simulations are extensively used to probe complex materials behavior and structure in order to obtain a deeper insight into the fundamentals of materials. Multi-physics models are becoming increasingly common, with advances in computational science, and are rapidly advancing the basic understanding of materials.

Description: Diffusion-controlled processes still remain the most important and interesting phenomena in materials science. Among the problems which are currently to the fore, are the synergy of diffusion and morphological evolution, the initial stages of solid-state reactions, the analysis of nano- materials and related phenomena, thermo- and electromigration, and the reliability of solder joints and interconnects in microelectronic devices. A number of challenging problems still remain within the “classical” areas of nucleation, reactive- and inter-diffusion, phase growth in multicomponent and binary systems, and decomposition and ripening.
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Description: Heat-treatment and thermal annealing are very common processing steps which have been employed during semiconductor manufacturing right from the beginning of integrated circuit technology. In order to minimize undesired diffusion, and other thermal budget-dependent effects, the trend has been to reduce the annealing time sharply by switching from standard furnace batch-processing (involving several hours or even days), to rapid thermal processing involving soaking times of just a few seconds. This transition from thermal equilibrium, to highly non-equilibrium, processing was very challenging and is still a field ripe for further development.

Description: Defect and Diffusion Forum Vol. 272

Description: This special-topic book, devoted to “Solid Phase Transformations” , covers a broad range of phenomena which are of importance in a number of technological processes. Most commercial alloys undergo thermal treatment after casting, with the aim of imparting desired compositions and/or optimal morphologies to the component phases.

Description: This special issue contains selected peer-reviewed papers which were presented at the Third International Conference on Diffusion in Solids and Liquids (DSL-2007), held at the Hotel Pestana Alvor Praia, Algarve, Portugal during the 4th-6th July, 2007.

Description: This special issue collects together relevant data spanning the quarter-century from 1982 to 2007. It comprises 936 entries, 220 tables and 44 figures. Wherever possible, the data are presented as Arrhenius expressions, giving a total of 304. The materials covered number 410 in all and include oxides based upon aluminium, barium, bismuth, boron, caesium, calcium, cerium, chromium, cobalt, copper, erbium, gadolinium, gallium, germanium, indium, iridium, iron, lanthanum, lead, lithium, magnesium, manganese, mercury, molybdenum, neodymium, nickel, niobium, phosphorus, plutonium, potassium, praseodymium, ruthenium, samarium, scandium, silicon, sodium, strontium, tantalum, tellurium, terbium, thorium, tin, titanium, tungsten, uranium, vanadium, ytterbium, yttrium, zinc and zirconium, plus their many compounds and solid solutions. Altogether, this volume provides a wealth of information on the topic.

Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
The main goal of these proceedings was to demonstrate the use of a variety of multi-scale approaches, ranging from the atomistic to the macroscopic level, and in this it succeeds admirably.

Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
The inspiration for this book was to gather together the efforts of those physicists, materials scientists/engineers and other scientists who are carrying out interdisciplinary research into multiscale modelling of time-evolving phenomena in materials.