Engineering Research
Materials Science
Engineering Series
Books by Keyword: Grain Boundary Diffusion
Books
Volume is indexed by Thomson Reuters CPCI-S (WoS)
Volume is indexed by Thomson Reuters CPCI-S (WoS).
The two-volume set therefore covers a very broad spectrum of topics. From the materials point of view, metals, alloys, intermetallics, elemental and compound semiconductors, amorphous materials, nonmetals such as fast ionic conductors, oxides, nitrides, polymers and even melts were discussed.
(i) the investigation and modelling of interfacial structure (ii) efforts to correlate structure/property relationships and (iii) phenomenological descriptions of particular interfacial properties The conference focussed on four objectives: 1.Grain Boundaries Structure and Properties 2.Dynamical and Mechanical Properties 3.Heterophase Interfaces 4.Electrical Properties and Superconductors.
The proceedings of an International Conference "Diffusion in Metals and Alloys" (DIMETA-82, Hungary, September 1982) are related to physical metallurgy and are dedicated to researching various types of diffusion processes in metals and alloys, intermetallic compounds, amorphous metals, and heterogeneous systems. There are articles in this issue also devoted to grain boundary and surface diffusion phenomena, crystallographic defects, and novel experimental methods of diffusion phenomena study.