Books by Keyword: Laser Annealing

Description: The development of solid-state semiconductor structures is at the forefront of technological innovation, driving advancements across various applications of microelectronics and high-power devices. The formation and processing of semiconductor solid-state structures involve a series of sophisticated and precision technologies that improve functionality and provide integration of finished components into complex circuits. This special edition is an essential resource for engineers and researchers involved in developing and applying semiconductor technologies.

Description: The International Conference on Silicon Carbide and Related Materials (ICSCRM) is the most important technical conference series on silicon carbide (SiC) and related materials. Started in Washington, D.C. in 1987, the conference series developed into a bi-annual global forum on SiC from its crystal growth to the reliability in application. After five conferences in the U.S., ICSCRM has been held every two years, alternating between USA, Europe, and Japan. The last three Conferences were held in Giardini Naxos, Italy (2015), Washington, D.C. , USA (2017), and Kyoto, Japan (2019). Due to the pandemic situation in 2020 and 2021, the alternating European edition, the 13th ECSCRM, has been held in 2021, and the 19th ICSCRM has been postponed to 2022. The 19th edition of ICSCRM will be the last of its kind – starting in 2023, the conference series will be united with the European edition. It will form an annual event under the well-established name ICSCRM and a new rotation schedule integrating the SiC communities worldwide.

Description: The special edition includes articles that represented the latest research results and engineering solutions in the area of silicon carbide wafer manufacturing for power electronics, functional polymer and composite materials for various applications and special microwave absorption materials for defence from electromagnetic radiation. This special edition will be interesting to semiconductor power device production specialists and many branches of applied materials science.

Description: The special edition includes articles that represented the latest research results and engineering solutions in the synthesis of nanomaterials, analysis processes of semiconductor wafer fabrication, and some decisions on coatings and exploration of tribological performance of several polymer and composite materials. This special edition will be interesting to specialists in nanomaterials synthesis, semiconductor power device production and protective coatings in machinery.

Description: This collection highlights the frontiers of current research in nanotechnology. The scope of the work, Perspectives of Nanoscience and Nanotechnology, focusses on the presentation of the current status of the science and technology in various aspects, giving examples of industrial and commercial applications and other invaluable information that could facilitate decisions and indicate future directions of research.

Description: Heat-treatment and thermal annealing are very common processing steps which have been employed during semiconductor manufacturing right from the beginning of integrated circuit technology. In order to minimize undesired diffusion, and other thermal budget-dependent effects, the trend has been to reduce the annealing time sharply by switching from standard furnace batch-processing (involving several hours or even days), to rapid thermal processing involving soaking times of just a few seconds. This transition from thermal equilibrium, to highly non-equilibrium, processing was very challenging and is still a field ripe for further development.