This special edition provides a comprehensive overview of the latest process enhancements that underpin the continued advancement of SiC-based device technologies by addressing methods of compound semiconductor processing and technologies of electronics device structure forming with a focus on end-device reliability.

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978-3-0364-0912-2

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eBook:

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ToC:

Table of contents

Editors:

Prof. Victor Veliadis and Dr. Arash Salemi

DOI:

https://doi.org/10.4028/b-cpJ1kh

THEMA:

TBN, TGM, TJFC, TJFD

BISAC:

TEC008000, TEC020000, TEC021000

Keywords:

Argon Plasma Treatment, Contact Formation, Contact Resistance, Gate Oxide, Gate Oxide Lifetime, Laser Ablation, Laser Annealing, Plasma Dicing, Schottky Barrier Diodes, Schottky Contacts, Silicon Carbide, Sulfurization, Trench Etching, Wafer Dicing

Details:

Special topic volume with invited peer-reviewed papers only

Pages:

106

Year:

2025

ISBN-13 (softcover):

9783036409122

ISBN-13 (eBook):

9783036419121

Permissions:

Creative Commons CC BY 4.0

Ringgold Subjects:

Materials Science, Manufacturing, Electronics