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Determination of Moisture / Water in Semiconductor Processing Liquids On-Line with the SemiChem Process Analyzer
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HomeSolid State PhenomenaSolid State Phenomena Vols. 65-66Fe and Cu Removal Efficiency in HF-DIW/O3 Cleaning...

Fe and Cu Removal Efficiency in HF-DIW/O₃ Cleaning Sequence

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Abstract:

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Ultra Clean Processing of Silicon Surfaces IV

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Periodical:

Solid State Phenomena (Volumes 65-66)

Pages:

109-112

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.65-66.109

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Online since:

November 1998

Authors:

Francesco Pipia, Enrico Bellandi, Barbara Crivelli, Mauro Alessandri

Keywords:

Cleaning, Metal Removal, Ozone

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© 1999 Trans Tech Publications Ltd. All Rights Reserved

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