Paper Titles
Surface Preparation Techniques for High-k Deposition on Ge Substrates
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Advanced Surface Cleaning Strategy for 65nm CMOS Device Performance Enhancement
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Process, Environmental & Economical Considerations to Implement Single Wafer Cleaning Tools in 300mm Wafer Fabs
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In Situ Wafer Processing for Next Generation Devices
p.45
Organic Contamination Control in Silicon Surface Processing
p.49
Application of UV/VIS-Spectroscopy for Determination of Complexing Agent Stability in APM and Like Mixtures Thereof
p.55
Plasma Cleaning for W Polymetal Gate
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Development of New Batch-Type Plasma Assisted NOR (Native-Oxide-Removal) Dry Cleaning Equipment
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Evaluation of Wafer Drying Methods for GIGA-LEVEL Device Fabrication
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Organic Contamination Control in Silicon Surface Processing

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Periodical:

Solid State Phenomena (Volumes 103-104)

Pages:

49-54

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.103-104.49

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Online since:

April 2005

Authors:

Koichiro Saga, Takeshi Hattori

Keywords:

GOI, Molecular Contamination, Organic Contamination, SCROD, TD-GC/MS

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© 2005 Trans Tech Publications Ltd. All Rights Reserved

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References

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