Paper Titles
Acknowledgements
Etching of Silicon Dioxide with Gas Phase HF and Water: Initiation, Bulk Etching, and Termination.
p.3
Evaluation of the Plasmaless Gaseous Etching Process
p.7
Single Wafer Hydrophobic Surface Preparation on 300mm by HF Vapor
p.11
Insights into HF-Last Processes and Particle Performance in a Single Wafer Spin Cleaning Tool
p.15
Implementing an In Situ Surface Preparation Prior to Ni Deposition for Ni Salicide Processes
p.19
Electrical Impact of Various Arsenic-Residues Cleanings
p.23
Elimination of Watermark on Extremely High-Doped Poly-Silicon Surfaces Using HF-Vapor Cleaning
p.27
Passivation Studies of Germanium Surfaces
p.33

Insights into HF-Last Processes and Particle Performance in a Single Wafer Spin Cleaning Tool

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Periodical:

Solid State Phenomena (Volume 134)

Pages:

15-18

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.134.15

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Online since:

November 2007

Authors:

Gim Chen, Ismail Kashkoush

Keywords:

Bare Silicon Wafer, HF Last, Particle Contamination, Single Wafer Processing

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© 2008 Trans Tech Publications Ltd. All Rights Reserved

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References

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