Paper Titles
Plastic Containers Contamination by Volatile Acids : Accumulation, Release and Transfer to Cu-Surfaces during Wafers Storage
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A Study on Germanium as a Contaminant Source in Semiconductor Fabrication Process
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Implementation of a System for Metal Contamination Control Based on Classification Criteria
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Study of Static Electricity in Wafer Cleaning Process
p.263
Mapping of Metallic Contamination Using TXRF
p.269
Investigation of Metallic Contamination Analysis Using Vapor Phase Decomposition – Droplet Collection – Total Reflection X-Ray Fluorescence (VPD-DC-TXRF) for Pt-Group Elements on Silicon Wafers
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X-Ray Spectrometry for Wafer Contamination Analysis and Speciation as Well as for Reference-Free Nanolayer Characterization
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Advanced Metrologies for Cleans Characterization: ARXPS, GIXF and NEXAFS
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Advanced TXRF Analysis: Background Reduction when Measuring High-k Materials and Mapping Metallic Contamination
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Mapping of Metallic Contamination Using TXRF

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Periodical:

Solid State Phenomena (Volume 134)

Pages:

269-272

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.134.269

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Online since:

November 2007

Authors:

Adrien Danel, Yannick Borde, Marc Veillerot, Nicolas Cabuil, H. Kono, M. Yamagami

Keywords:

Metallic Contamination, Silicon Wafer, TXRF

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© 2008 Trans Tech Publications Ltd. All Rights Reserved

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References

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