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Articles by author: Akira Izumi

• A Novel Copper Interconnection Cleaning by Atomic Hydrogen Using Diluted Hydrogen Gas
  Published in: Ultra Clean Processing of Semiconductor Surfaces IX (p389)
• A Novel Surface Cleaning for Copper Interconnection Using Ammonium Decomposed Species Generated by Hot Wire
  Published in: Ultra Clean Processing of Semiconductor Surfaces VIII (p307)
• Application of Single-Wafer Wet Cleaning Prior to Epitaxial SiGe Process
  Published in: Ultra Clean Processing of Semiconductor Surfaces IX (p173)
• Challenges of Single-Wafer Wet Cleaning for Low Temperature Pre-Epitaxial Treatment of SiGe
  Published in: Ultra Clean Processing of Semiconductor Surfaces VIII (p243)
• Effective Rinse Aiming at Water-Mark-Free Drying for Single-Spin Wet Cleaning Process
  Published in: Ultra Clean Processing of Silicon Surfaces VII (p79)
• Formation of Highly Transparent SiCN Films Prepared by HWCVD
  Published in: Smart Materials & Micro/Nanosystems (p223)
• Novel Photoresist Removal Using Atomic Hydrogen Generated by Heated Catalyzer
  Published in: Ultra Clean Processing of Silicon Surfaces VI (p231)
• Single-Wafer Wet Chemical Oxide Formation for Pre-ALD High-k Deposition on 300 mm Wafer
  Published in: Ultra Clean Processing of Semiconductor Surfaces VIII (p53)
• Structural and Electrical Characterization of Ultra-Thin SiO₂ Films Prepared by Catalytic Oxidation Method
  Published in: Ultra Clean Processing of Silicon Surfaces V (p157)