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Articles by author: Didier Lévy

• Advanced Surface Cleaning Strategy for 65nm CMOS Device Performance Enhancement
  Published in: Ultra Clean Processing of Silicon Surfaces VII (p37)
• Cation Partitioning in Mg_0.70Fe_0.23Al_1.97O₄ Synthetic Spinels by in situ Neutron Powder Diffraction
  Published in: European Powder Diffraction 5 (p692)
• Dual Gate Oxide for 0.18μm Technologies and Below: Optimization of the Wet Processing Sequence
  Published in: Ultra Clean Processing of Silicon Surfaces V (p27)
• Electrochemical Study for the Characterization of Wet Silicon Oxide Surfaces
  Published in: Ultra Clean Processing of Silicon Surfaces V (p81)
• Industrial Trends in Wet Processing Technology
  Published in: Ultra Clean Processing of Silicon Surfaces IV (p31)
• Optimisations of SC-1 Conditions for Sub 0.18μm Technologies in an Industrial Environment
  Published in: Ultra Clean Processing of Silicon Surfaces V (p93)
• Photoresist Adhesion during Wet Etch on Single Wafer Tool
  Published in: Ultra Clean Processing of Semiconductor Surfaces IX (p219)
• Post Copper CMP: a Two Steps Cleaning Recipe
  Published in: Ultra Clean Processing of Silicon Surfaces V (p299)
• Process, Environmental & Economical Considerations to Implement Single Wafer Cleaning Tools in 300mm Wafer Fabs
  Published in: Ultra Clean Processing of Silicon Surfaces VII (p41)
• Surface Preparation Challenge on Nitrided Gate Oxides
  Published in: Ultra Clean Processing of Semiconductor Surfaces VIII (p71)
• Thermal Expansion of Chromites and Zinc Spinels
  Published in: European Powder Diffraction 5 (p390)