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Articles by author: Werner Boullart

• A Descum Review for Cleaning Surfaces in Polymer Embedded Process Flows
  Published in: Ultra Clean Processing of Semiconductor Surfaces X (p215)
• Confined Chemical Cleaning: A Novel Concept Evaluated for Front End of Line Applications
  Published in: Ultra Clean Processing of Semiconductor Surfaces VIII (p121)
• Effect of Chemical Solution on the Stability of Low-k Films
  Published in: Ultra Clean Processing of Silicon Surfaces VII (p349)
• Evaluation of Post Metal Etch Cleaning by Analyzing the Chemical Compositions and Distributions on the Etched Al Surface
  Published in: Ultra Clean Processing of Silicon Surfaces IV (p177)
• HF Based Solutions for HfO₂ Removal; Effect of pH and Temperature on HfO₂: SiO₂ Etch Selectivity
  Published in: Ultra Clean Processing of Silicon Surfaces VII (p97)
• Post Extension Ion Implant Photo Resist Strip for 32 nm Technology and beyond
  Published in: Ultra Clean Processing of Semiconductor Surfaces IX (p253)
• Post Metal Etch Polymer Removal: An Investigation of Parameters that Influence Corrosion
  Published in: Ultra Clean Processing of Silicon Surfaces IV (p283)
• Resist Strip and Cu Diffusion Barrier Etch in Cu BEOL Integration Schemes in a Mattson Highlands^TM Chamber
  Published in: Ultra Clean Processing of Silicon Surfaces VI (p267)
• Selective Wet Removal of Hf-Based Layers and Post-Dry Etch Residues in High-k and Metal Gate Stacks
  Published in: Ultra Clean Processing of Silicon Surfaces VII (p93)
• Study of a Metal Gate and Silicon Selective “Dry Ash Only” Process for Combined Extension and Halo Implanted Photo Resist
  Published in: Ultra Clean Processing of Semiconductor Surfaces VIII (p113)