The Study of Direct Tunneling Current in Strained MOS Device with Silicon Nitride Stack Gate Dielectric

Article Preview

Abstract:

As the size of MOS device scaled down to sub 100nm, the direct tunneling current of gate oxide increases more and more. Using silicon nitride as gate dielectric can solve this problem effectively in some time due to the dielectric constant of silicon nitride is larger than silica’s.This paper derived the dielectric constant of silicon nitride stack gate dielectric,and simulated the direct tunneling current of strained MOS device with silica and silicon nitride gate dielectric through device simulation software ISE TCAD10.0,studied the direct tunneling current of strained MOS device with silicon nitride stack gate dielectric change with the variation of some parameters and the application limit of silicon nitride material.

You might also be interested in these eBooks

Info:

Periodical:

Pages:

5442-5446

Citation:

Online since:

October 2011

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2012 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

[1] Semiconductor Industry Association National Technology Roadmap for Semiconductors[Z]. Austin, TX. (1997).

Google Scholar

[2] Wilk GD, Wallace RM, Anthony JM. High-k gate dielectrics: current status and materials properties considerations[J]. J Appl Phys, 2001; 89 (9) : 5243-5246.

DOI: 10.1063/1.1361065

Google Scholar

[3] Chatterjee A. CMOS metal replacement gate transistors using tantalum pentoxide gate insulator[A]. IEEE IEDM TechnicalDigest[C]. 1998; 777-779.

Google Scholar

[4] Wong H, Cheng Y C. Electronic conduction mechanisms in thin oxynitride films[J]. Journal of Applied Physics, 1991, 70(2): 1078-1080.

DOI: 10.1063/1.349673

Google Scholar

[5] Hou Y T, Li M F , Yu H Y, Jin Y, Kwong D L 2002 International Electron Devices Meetings 2002 December, San Francisco, CA, USA 731.

Google Scholar