Effect of Mixing Parameter on Electrical Conductivity of Carbon Black/Graphite/Epoxy Nanocomposite Using Taguchi Method

Abstract:

Polymer composite has attracted many researchers from various field of application due to its unique features and properties including light weight, low cost, ease to process and shaping and corrosion resistant [1-3]. Fillers is typically added to enhance the chemical and physical properties of polymers [4, 5]. One of the properties is the electrical conductivity. Carbon based filler such as graphite (G), carbon black (CB), carbon fibers (CF) and carbon nanotubes (CNT) has been extensively used to improve electrical properties of polymer composite [6-8]. Electrical properties of the composite can be explained from percolation theory which means electrical percolation in mixtures of electrically conducting and non-conducting materials [9]. The concentration of conducting phase must above the critical value called percolation threshold, in order for the material become electrically conductive [10].

• Periodical: Applied Mechanics and Materials (Volume 393)
• Pages: 68-73
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.393.68
• Online since: September 2013
• Authors: Mohd Yusuf Zakaria, Hendra Suherman, Jaafar Sahari, Abu Bakar Sulong
• Keywords: Electrical Conductivity, Mixing Parameters, Nanocomposite, Taguchi Method

References

[1] H. Kishi, M. Kuwata, S. Matsuda, T. Asami, A. Murakami, Composites Science and Technology, 64 (2004) 2517-2523.

DOI: 10.1016/j.compscitech.2004.05.006

[2] S. Liao, C. Yen, C. Weng, Y. Lin, C. Ma, C. Yang, M. Tsai, M. Yen, M. Hsiao, S. Lee, Journal of Power Sources, 185 (2008) 1225-1232.

DOI: 10.1016/j.jpowsour.2008.06.097

[3] L.N. Song, M. Xiao, Y.Z. Meng, Composites Science and Technology, 66 (2006) 2156-2162.

[4] J.F. Feller, I. Linossier, Y. Grohens, Materials Letters, 57 (2002) 64-71.

[5] M.H. Al-Saleh, U. Sundararaj, Composites Part A: Applied Science and Manufacturing, 42 (2011) 2126-2142.

DOI: 10.1016/j.compositesa.2011.08.005

[6] A. Rybak, G. Boiteux, F. Melis, G. Seytre, Composites Science and Technology, 70 (2010) 410-416.

DOI: 10.1016/j.compscitech.2009.11.019

[7] J.H. Lee, Y.K. Jang, C.E. Hong, N.H. Kim, P. Li, H.K. Lee, Journal of Power Sources, 193 (2009) 523-529.

[8] R.A. Antunes, M.C.L. de Oliveira, G. Ett, V. Ett, Journal of Power Sources, 196 (2011) 2945-2961.

DOI: 10.1016/j.jpowsour.2010.12.041

[9] B.K. Kakati, D. Sathiyamoorthy, A. Verma, International Journal of Hydrogen Energy, 36 (2011) 14851-14857.

DOI: 10.1016/j.ijhydene.2011.02.136

[10] Y.A. Balogun, R.C. Buchanan, Composites Science and Technology, 70 (2010) 892-900.

[11] H. Deng, T. Skipa, R. Zhang, D. Lellinger, E. Bilotti, I. Alig, T. Peijs, Polymer, 50 (2009) 3747-3754.

DOI: 10.1016/j.polymer.2009.05.016

[12] M. Murariu, A.L. Dechief, L. Bonnaud, Y. Paint, A. Gallos, G. Fontaine, S. Bourbigot, P. Dubois, Polymer Degradation and Stability, 95 (2010) 889-900.

DOI: 10.1016/j.polymdegradstab.2009.12.019

[13] Y. Pan, L. Li, S.H. Chan, J. Zhao, Composites Part A: Applied Science and Manufacturing, 41 (2010) 419-426.

[14] N. Hu, Z. Masuda, G. Yamamoto, H. Fukunaga, T. Hashida, J. Qiu, Composites Part A: Applied Science and Manufacturing, 39 (2008) 893-903.

DOI: 10.1016/j.compositesa.2008.01.002

[15] X. Xie, Y. Mai, X. Zhou, Materials Science and Engineering: R: Reports, 49 (2005) 89-112.

[16] İ. Asiltürk, H. Akkuş, Measurement, 44 (2011) 1697-1704.

[17] J.L. Lin, K.S. Wang, B.H. Yan, Y.S. Tarng, Journal of Materials Processing Technology, 102 (2000) 48-55.

[18] A.B. Sulong, J. Park, C.H. Azhari, K. Jusoff, Composites Part B: Engineering, 42 (2011) 11-17.

[19] Y. Wang, D.O. Northwood, Journal of Power Sources, 185 (2008) 226-232.

[20] C.Y. Chang, R. Huang, P.C. Lee, T.L. Weng, Cement and Concrete Composites, 33 (2011) 1038-1049.

[21] Y. -C. Lin, Y. -F. Chen, D. -A. Wang, H. -S. Lee, Journal of Materials Processing Technology, 209 (2009) 3374-3383.

[22] Phadke, M.S., 1989, Quality Engineering Using Robust Design,. Prentice Hall International Inc., New York.