High Topography Polyimide CMP Process

Abstract:

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This paper reports a process of filling and planarization of microstructures for MEMS and wafer level packaging application. In this work, cavities of 5-10mm depth and 20-100mm in length/width are filled using multiple coatings of polyimide with kinematic viscosities in the range of 20-130St. Such filling results in overfilling of polyimide in the range of 2 to 10mm due to variation in density and geometry of microstructure. A chemical and mechanical polishing (CMP) based planarization process, to achieve polyimide thickness variation <0.2mm in varied structures is presented.

Info:

Periodical:

Edited by:

Lynn Khine and Julius M. Tsai

Pages:

107-110

DOI:

10.4028/www.scientific.net/AMR.254.107

Citation:

Y. J. Mao et al., "High Topography Polyimide CMP Process", Advanced Materials Research, Vol. 254, pp. 107-110, 2011

Online since:

May 2011

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Price:

$35.00

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