Mechanical Study of Copper Bonded at Low Temperature Using Spark Plasma Sintering Process

Bassem Mouawad; Maher Soueidan; Damien Fabrègue; Cyril Buttay; Vincent Bley; Bruno Allard

doi:10.4028/www.scientific.net/AMR.324.177

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Spectrophotometric Study of Cobalt (II) Chlorocomplexes in Methanol in the Visible Domain
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Mechanical Study of Copper Bonded at Low Temperature Using Spark Plasma Sintering Process
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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 324Mechanical Study of Copper Bonded at Low...

Mechanical Study of Copper Bonded at Low Temperature Using Spark Plasma Sintering Process

Abstract:

Bonding of high purity polished copper was investigated using the Spark Plasma Sintering technique (SPS) showing the effect of SPS parameters (surface roughness, time, temperature and pressure) on the bonding strength behaviour. Mechanical characterization of the bonded samples was performed at room temperature using tensile test. Two surfaces roughnesses were studied (un-polished and polished samples). It was found that the bonding strength varied from 50 MPa to 233 MPa for un-polished and polished surfaces respectively The tensile strength of the used bulk copper-rod was found to be 365 MPa, while most results are over 122 MPa (a third of the bulk value).

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Periodical:

Advanced Materials Research (Volume 324)

Pages:

177-180

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.324.177

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Online since:

August 2011

Authors:

Bassem Mouawad, Maher Soueidan, Damien Fabrègue, Cyril Buttay, Vincent Bley, Bruno Allard

Keywords:

Copper Bonding, Spark Plasma Sintering (SPS), Tensile Test

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