Advanced Materials Research Vol. 497

Abstract: Resin bond is one of the most widely bond used for manufacturing abrasive product. This review paper discusses historical perspectives on resin bond, there are different abrasive products which can be produced by using various types of resin bond such as modification of Phonetic resin and a new water-soluble resin. It is intended to help readers to gain a more comprehensive view on resin bond used for abrasive products and to be instrumental for research and development in producing abrasive products.

Abstract: The soluble filler in the newly developed metal bonded superabrasive tool named porous self-generation superabrasive tool (PSST) plays the most important role. To investigate the influence of filler material and its content on the mechanical properties, Zn, CaO, SiO₂ are employed as the soluble filler.Shear experiments and lapping experiments are carried out. It is found that the shear force of PSST with Zn is the highest, and declines little from 3.2 kN to 2.9kN with increase of filler content from 10wt% to 30wt%. On the contrary, the shear force of PSSTs with CaO and SiO₂ decline obviously from 2.1kN to 1.2kN, and 1.7kN to 0.6kN respectively. The wear rate of PSST depends on not only its own mechanical strength but also the dissolution rate of the filler. It comes out that the wear rate of PSST with Zn is similar to that of PSST with SiO₂, ranges from 0.04mm/h to 0.13mm/h. The wear rate of PSST with CaO is much lower, ranges from 0.02 mm/h to 0.08 mm/h.

Abstract: In order to study on soil vibratory cutting resistance reduction, the soil static cutting mechanics model and large deformation cutting of yield failure mode are studied in this paper. According to the interaction process of deep shovel-soil, the static cutting resistance changes of deep shovel was analyzed by finite simulation algorithm of ALE and soil-tools interaction 3D finite element model, and further the influences of the soil-cutting resistance to the vibration source type, the vibration frequency and vibration amplitude were studied. As an example of a compaction soil in tea garden, the law of soil resistance reduction influenced by vibration type and tool cutting-speed with difference vibratory cutting conditions was studied, the results show that the soil resistance reduced with the vibration frequency and amplitude increased, and vibration frequency, amplitude were taken to 25Hz, 14mm, soil cutting was up to minimum resistance, reduced about 22%. So, above-mentioned studies provided the basis of soil cutting resistance reduction with vibration.

Abstract: The demand of high quality for plastic products has facilitated the development of Plastic Injection Molding Technology, many new sorts of methods were created to improve the surface quality of plastic products, such as Rapid Heat Cycle Molding. But the temperature response law hasn’t figured out yet, and the influence elements of this process haven’t been clear, which seriously delay the appliction of Rapid Heat Cycle Molding.

Abstract: Tool breakage monitoring is crucial to automation fabrication, especially for high-density hole machining, such as PCB (Printed Circuit Board). A tool breakage feature extraction method in PCB micro-hole drilling is presented in this paper. The vibration signal is analyzed by wavelet transform. The decomposed signals energy ratio at each frequency band is computed as monitoring features. The monitoring performance of different features selection is given. The vibration signals are observed to provide the capability in distinguishing micro drill breakage with proper features extraction and classifier design.

Abstract: process parameters; surface gloss; Rapid Heat Cycle Molding Abstract: Rapid Heat Cycle Molding is a novel injection molding, which may improve product surface quality effectively. In this paper, one-factor experimental design and Taguchi method were used and the influence of different process parameters (mold heating temperature, melt temperature, injection rate, injection pressure, and packing pressure) on surface gloss of injection product was studied. The results showed that temperature is the significant factor to the surface gloss. Mold heating temperature is principal factor in mold process parameters, while the melt temperature is the secondary factor and injection pressure is the least. The surface gloss increases with increasing mold heating temperature, melt temperature, injection rate through whole processing, while it increases to top then decreases with increasing injecting and packing pressure

Abstract: A thermal-type contact sensor was proposed to detect small defects, the heights of which are less than 16 nm, on the wafer surface. The feasibility of the contact sensor, which detects frictional heat generated at the contact, was theoretically investigated focusing on the temperature rise of the sensor element. Simulation results with both the simple model of heat transfer and the FEM model showed that the expected temperature rise of the contact sensor is enough to be detected by the conventional electric circuit.

Abstract: A method for absolutely testing off-axis aspherical mirror is presented. A dichotomy CGH including two zones on one substrate is designed. One sub aperture generates the spherical wave front that is used for calibrating the pattern errors of the hologram; the other sub aperture reconstructs the aspherical wave front to test the off-axis aspherical mirror. By means of known absolute interferometric methods, the aberrations of the calibration wave front can be obtained. These aberrations can be transferred to the null testing wave front. The testing method is explained and the dichotomy CGH is designed. Finally, a simulation result supports this absolutely testing method.

Abstract: This paper presents a new control method of the Z-direction module of STM (scanning tunnel microscope). The major component of our method is a dual-servo mechanism, which is consist of a PZT (Piezoelectric Transducer) and a motorized micro displacement stage. Traditionally, STM employs PZT as the servo scanner, which provides very high precision but has a small range. The mean idea of our method is compensating the insufficient measuring range of the PZT through a motorized micro displacement stage. Our method succeeds to eliminates the limitation of measuring range of PZT and enlarges the vertical measurement scale of STM from sub-micrometer to sub-millimetre.

Abstract: This document presents an integrated detection method for the whole cycle of silicon wafer processing based on Scanning Acoustic Microscope (SAM). It can be used for thickness and chamfering measurement, surface and subsurface testing, internal defects detection and identification. A SAM system was designed for silicon processing and silicon-based devices fabrication. It has more favorable measuring accuracy and quantitative analysis ability than the traditional inspection equipments using for wafer process such as infrared detector.