Study on the Gold-Gold Thermocompression Bonding for Wafer-Level Packaging

Jing Wu; Shi Xing Jia; Yun Xiang Wang; Jian Zhu

doi:10.4028/www.scientific.net/AMR.60-61.325

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 60-61Study on the Gold-Gold Thermocompression Bonding...

Study on the Gold-Gold Thermocompression Bonding for Wafer-Level Packaging

Abstract:

The study is performed to implement the Gold-Gold thermocompression bonding for the wafer-level packaging of MEMS chips. Numerous experimental attempts have been carried out to select the metal film adhesive to avoid the Au-Si melt together and optimize bonding processes to intensify the Au-Au eutectic bonding. Finally the results display that the eutectic bonding of the gold-gold are arrived as electrical as well as mechanical interconnection of the MEMS structure and as seal as well as bonding intension.