Study on the Gold-Gold Thermocompression Bonding for Wafer-Level Packaging
The study is performed to implement the Gold-Gold thermocompression bonding for the wafer-level packaging of MEMS chips. Numerous experimental attempts have been carried out to select the metal film adhesive to avoid the Au-Si melt together and optimize bonding processes to intensify the Au-Au eutectic bonding. Finally the results display that the eutectic bonding of the gold-gold are arrived as electrical as well as mechanical interconnection of the MEMS structure and as seal as well as bonding intension.
J. Wu et al., "Study on the Gold-Gold Thermocompression Bonding for Wafer-Level Packaging ", Advanced Materials Research, Vols. 60-61, pp. 325-329, 2009