Study on the Gold-Gold Thermocompression Bonding for Wafer-Level Packaging

Abstract:

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The study is performed to implement the Gold-Gold thermocompression bonding for the wafer-level packaging of MEMS chips. Numerous experimental attempts have been carried out to select the metal film adhesive to avoid the Au-Si melt together and optimize bonding processes to intensify the Au-Au eutectic bonding. Finally the results display that the eutectic bonding of the gold-gold are arrived as electrical as well as mechanical interconnection of the MEMS structure and as seal as well as bonding intension.

Info:

Periodical:

Advanced Materials Research (Volumes 60-61)

Edited by:

Xiaohao Wang

Pages:

325-329

DOI:

10.4028/www.scientific.net/AMR.60-61.325

Citation:

J. Wu et al., "Study on the Gold-Gold Thermocompression Bonding for Wafer-Level Packaging ", Advanced Materials Research, Vols. 60-61, pp. 325-329, 2009

Online since:

January 2009

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Price:

$35.00

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