This work is focused on design and fabrication of a hybrid-type electrostatic silicon microgripper integrated vacuum tool. Vacuum tools are integrated in this novel microgripper in order to improve its pick and place capability. Surface and bulk micromachining technology is employed to fabricate the microgripper from single crystal silicon wafer (i.e., no silicon on insulator wafer is used). And the bonding technology is used to form the gas pipes for the vacuum tool. The linear motion of the microactuator is converted into a rotational gripping motion by a system of spring beams. At a driving voltage of 80V, a deflection of 25μm at the arm tip of the gripper is achieved.