Molecular Dynamics Modeling and Effects of Cutting Parameters on Nanometric Cutting Process
In nanometric cutting process, the actual material removal can take place at atomic level, which makes the observation of machining phenomena and the measurement of cutting parameters difficult or impossible in experiments. However, it is crucial to investigate the cutting process in nanoscale. In this work, molecular dynamics (MD) is used to study effects of cutting parameters on nanometric cutting process with the aid of EAM potential. The result of the simulation shows that higher cutting speed leads to a rough machined surface with a relative large deformation in workpiece. It is found that a smaller cutting depth results in less plastic deformation and fewer dislocations in workpiece, and also results in a smoother machined surface. Rake angle has big effect on the chip formation, potential energy and the machined surface.
J. C. Wang et al., "Molecular Dynamics Modeling and Effects of Cutting Parameters on Nanometric Cutting Process", Advanced Materials Research, Vols. 60-61, pp. 435-438, 2009