The Model of Nano-Scale Cu-Particle Removal in CO₂-Based Micelle Solutions with Different Surfactants

Abstract:

This work focused on the analysis of static forces of a Cu particle in CO₂-based micelle solutions with different surfactant, including fluorinated surfactants PFPE COO^-NH₄⁺, 8FS(EO)₂ and hydrocarbon surfactants L31, DiF₈-PO₄^-Na⁺. Calculations demonstrated that high pressure could impose enough capillary pressure effect beneath a particle to compete with the net adhesion force and increase the particle surface separation distance. The ESD for the micelle solutions had the similar behavior, otherwise, the value of NAF for the micelle solution with surfactant DiF₈-PO₄^-Na⁺ had the minimum relative to other surfactant micelle solutions, suggesting that Cu particles would be more easily removed in micelle solution with DiF₈-PO₄^-Na⁺ surfactant.

• Periodical: Advanced Materials Research (Volume 936)
• Pages: 624-627
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.936.624
• Online since: June 2014
• Authors: Yun Run Wang*
• Keywords: Carbon Dioxide, Equilibrium Separation Distance, High-Pressure, Net Adhesion Force, Surfactant

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