Failure Analysis of the Solder Joints in Flip-Chip BGA Packages under Free-Drop Test

Abstract:

The failure of plastic ball grid array under intense dynamic loading was studied in the project. This paper presents the drop test reliability results of SnPb flip-chip on a standard JEDEC drop reliability test board. The failure mode and mechanism of planar array package in the drop test was comprehensively analyzed. High acceleration dropping test method was used to research the reliability of BGA (ball grid array) packages during the free-drop impact process. The model RS-DP-03A drop device was used to simulate the falling behavior of BGA chip packages under the real conditions, The drop condition meets the JEDEC22-B111 standards (pulse peak 1500g, pulse duration 0.5 ms) when dropping from the 650mm height . In the testing, according to the real-time changes of dynamic voltage, the relationship between drop times and different phases of package failure was analyzed. With the dye-penetrated method and optical microscopy, it was easy to observe the internal crack and failure locations. The growth mechanism of the cracks in solder joints under the condition of drop-free was analyzed and discussed.

• Periodical: Advanced Materials Research (Volume 936)
• Pages: 628-632
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.936.628
• Online since: June 2014
• Authors: Guo Zheng Yuan, Xia Chen, Xue Feng Shu*
• Keywords: BGA Packages, Drop Test, Failure Analysis, Free-Drop

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