Wet Etching of Si Micro-Arrays: Experimental and Theoretical Shapes

Abstract:

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In this paper emphasis is placed on the wet micromachining of silicon micro-arrays constituted by very small holes. Microfabrication of various Silicon plates is performed in a KOH etchant maintained at constant temperature. Limitations due to the process are given. A self elaborated simulator is used to predict etching shapes of several micro holes. A comparison between experiments and simulation is presented.

Info:

Periodical:

Edited by:

Pietro VINCENZINI and Giuseppe D'ARRIGO

Pages:

445-450

DOI:

10.4028/www.scientific.net/AST.54.445

Citation:

T. G. Leblois and C.R. Tellier, "Wet Etching of Si Micro-Arrays: Experimental and Theoretical Shapes", Advances in Science and Technology, Vol. 54, pp. 445-450, 2008

Online since:

September 2008

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$35.00

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