Wet Etching of Si Micro-Arrays: Experimental and Theoretical Shapes

Therese G. Leblois; C.R. Tellier

doi:10.4028/www.scientific.net/AST.54.445

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HomeAdvances in Science and TechnologyAdvances in Science and Technology Vol. 54Wet Etching of Si Micro-Arrays: Experimental and...

Wet Etching of Si Micro-Arrays: Experimental and Theoretical Shapes

Abstract:

In this paper emphasis is placed on the wet micromachining of silicon micro-arrays constituted by very small holes. Microfabrication of various Silicon plates is performed in a KOH etchant maintained at constant temperature. Limitations due to the process are given. A self elaborated simulator is used to predict etching shapes of several micro holes. A comparison between experiments and simulation is presented.